Nowe Złącza gniazd pamięci
TE Connectivity's (TE) Compression Attached Memory Module 2 (CAMM2) Memory Connectors feature a next-generation memory module interface that is part of the Joint Electron Device Engineering Council (JEDEC) JESD318 standard. TE CAMM2 Memory Connectors are designed to replace traditional Small Outline Dual In-Line Memory Modules (SODIMMs) in laptops and compact computing devices. These connectors offer improved performance, enhanced thermal efficiency, and higher memory densities compared to previous-generation memory connectors. Applications include high-performance computing, embedded systems and Internet of Things (IoT) devices, automotive, aerospace and defense, medical devices, telecommunications and networking, AI and robotics, and consumer electronics.
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TE Connectivity CAMM2 Memory ConnectorsFeatures a next-generation memory module interface that is part of the JEDEC JESD318 standard.23.12.2025
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Amphenol DDR5/LPDDR5 CAMM2 ConnectorsMeets JEDEC standards and features 644 or 666 pins and a 1mm x 1.38mm pitch.04.06.2025 -
Amphenol DDR5 SO-DIMM ConnectorsDelivers high speed and bandwidth at half the size of regular DIMMs, lower power consumption.23.11.2022 -
TE Connectivity Gniazda pamięci DIMM DDR5Zaprojektowane z myślą o wysokowydajnych platformach obliczeniowych i serwerowych i obsłudze przepustowości do 6,4 GT/s.08.11.2022