Nowe układy scalone i gniazda podzespołów
TE Connectivity's (TE) LGA7529 Socket and Hardware include a socket for next-generation server processors, providing more connections between the motherboard and the processor. This socket features 7529 pins, delivering increased performance and data bandwidth to support top processor multi-core architecture and high-throughput workloads. Reliable and easy installation is provided by these products, which are qualified and tested for durability and environmental resistance, including vibration and shock. LGA7529 hardware includes back plates, bolster plates, carriers, and socket covers. TE LGA7529 Socket and Hardware are suitable for networking equipment, Cloud service, servers, switches, edge computing, hyperscale, and artificial intelligence (AI).
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TE Connectivity Gniazdo i osprzęt LGA7529For next-generation server processors, providing connections between the motherboard & processor.02.05.2025
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Mill-Max Organic Fibre-Plug® ReceptaclesCovers a wide range of lead sizes and offers early engagement/dual-entry capability.29.08.2024 -
TE Connectivity Gniazda DIP (z dwoma rzędami styków)Mają dwie opcje konfiguracji styków zapewniające elastyczność aplikacji: cztery palce i podwójne blaszki.19.08.2024 -
TE Connectivity LGA 4710 SocketsNext-generation server processor that supports PCIe generation 5 technology and 8-channel DDR5.15.08.2024 -
TE Connectivity Gniazda jednorzędowe (Single In-Line, SIP)Mają obrabianą maszynowo żeńską końcówkę zapewniającą niezawodne połączenie.13.08.2024 -
Chip Quik DIP300 SOIC AdaptersFeatures wide- and narrow-bodied adapters with a 10-28 dual in-line package (DIP) range.15.12.2023