Wyniki: 4 277
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 Produc.
Opis Karta charakterystyki Dostępność Wycena (PLN) Filtruj wyniki w tabeli wg ceny jednostkowej zależnej od ilości.
Il. RoHS Model ECAD Produkt
Liczba pozycji
Skok
Liczba rzędów
Styl styku
Kąt montażu
Wysokość stosu
Prąd znamionowy
Napięcie znamionowe
Maksymalna szybkość transmisji danych
Minimalna temperatura robocza
Maksymalna temperatura robocza
Pokrycie styku
Materiał styku
Materiał oprawy
Seria
Opakowanie
Samtec Board to Board & Mezzanine Connectors 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Karta charakterystyki
1 159Na stanie magazynowym
Min.: 1
Wielokr.: 1

Headers 120 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 25 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Tray
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
2 601Na stanie magazynowym
Min.: 1
Wielokr.: 1
: 250

Sockets 240 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
1 185Na stanie magazynowym
Min.: 1
Wielokr.: 1
: 225

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
853Na stanie magazynowym
Min.: 1
Wielokr.: 1
: 225

Headers 320 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
1 377Na stanie magazynowym
Min.: 1
Wielokr.: 1
: 200

Headers 240 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 11 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
100Na stanie magazynowym
Min.: 1
Wielokr.: 1
: 100

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 12 mm, 13 mm, 13.5 mm, 14.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
200Na stanie magazynowym
Min.: 1
Wielokr.: 1
: 200

Headers 300 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 11 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.80 mm Q Strip High-Speed Ground Plane Socket Strip
Karta charakterystyki
133Na stanie magazynowym
Min.: 1
Wielokr.: 1

Sockets 84 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 5 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSE Tray
Samtec Board to Board & Mezzanine Connectors 0.50 mm Q Strip High-Speed Ground Plane Socket Strip
Karta charakterystyki
319Na stanie magazynowym
Min.: 1
Wielokr.: 1

Sockets 40 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 A 175 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSH Tray
Samtec Board to Board & Mezzanine Connectors Q Strip High-Speed Ground Plane Header
Karta charakterystyki
998Na stanie magazynowym
Min.: 1
Wielokr.: 1
: 150

Headers 40 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 11 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors Q Strip High-Speed Ground Plane Header
Karta charakterystyki
683Na stanie magazynowym
Min.: 1
Wielokr.: 1
: 100

Headers 120 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 16 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Karta charakterystyki
266Na stanie magazynowym
Min.: 1
Wielokr.: 1
: 150

Headers 180 Position 0.5 mm (0.02 in) 2 Row Solder Straight 11 mm 2 A 175 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
725Na stanie magazynowym
Min.: 1
Wielokr.: 1
: 250

Sockets 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
60Na stanie magazynowym
Min.: 1
Wielokr.: 1
: 75

Headers 200 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 16 mm, 17 mm, 17.5 mm, 18.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
94Na stanie magazynowym
Min.: 1
Wielokr.: 1
: 125

Headers 120 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 12 mm, 13 mm, 13.5 mm, 14.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
186Na stanie magazynowym
Min.: 1
Wielokr.: 1
: 225

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
61Na stanie magazynowym
Min.: 1
Wielokr.: 1
: 200

Headers 500 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.50 mm Q Strip High-Speed Ground Plane Socket Strip
Karta charakterystyki
1 172Na stanie magazynowym
Min.: 1
Wielokr.: 1

Sockets 180 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 A 175 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSH Tray
Samtec Board to Board & Mezzanine Connectors Q Strip High-Speed Ground Plane Header
Karta charakterystyki
480Na stanie magazynowym
Min.: 1
Wielokr.: 1

Headers 40 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 16 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Board to Board & Mezzanine Connectors 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Karta charakterystyki
261Na stanie magazynowym
Min.: 1
Wielokr.: 1
: 150

Headers 120 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 11 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Karta charakterystyki
260Na stanie magazynowym
Min.: 1
Wielokr.: 1

Headers 180 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 8 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Tray
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
243Na stanie magazynowym
Min.: 1
Wielokr.: 1
: 325

Sockets 120 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
275Na stanie magazynowym
Min.: 1
Wielokr.: 1
: 225

Headers 200 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
317Na stanie magazynowym
Min.: 1
Wielokr.: 1
: 325

Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
225Na stanie magazynowym
Min.: 1
Wielokr.: 1
: 200

Headers 400 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape