UDx6 AcceleRate® mP 0.635mm Signal/Power Arrays

Samtec UDx6 AcceleRate® mP 0.635mm Signal/Power Arrays are 0.635mm pitch high-density, high-speed signal/power arrays that achieve 64Gbps PAM4 speeds. These Samtech signal/power arrays feature rotated power blades for improved performance and simplified breakout region (BOR). These UDx6 AcceleRate MP series features 5mm and 10mm stack heights and up to 10 power and 240 signal positions. The signal/power arrays offer an open-pin-field design for routing and grounding flexibility. The series includes optional alignment pins, standard weld tabs for a secure connection to the board, and polarized guide posts for blind mating.

Wyniki: 40
Wybierz Obraz Nr części Produc. Opis Karta charakterystyki Dostępność Wycena (PLN) Filtruj wyniki w tabeli wg ceny jednostkowej zależnej od ilości. Il. RoHS Model ECAD Produkt Liczba pozycji Skok Liczba rzędów Styl styku Kąt montażu Prąd znamionowy Napięcie znamionowe Maksymalna szybkość transmisji danych Minimalna temperatura robocza Maksymalna temperatura robocza Pokrycie styku Materiał styku Materiał oprawy Seria
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25Oczekiwane: 14.09.2026
Min.: 1
Wielokr.: 1

Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25Oczekiwane: 07.09.2026
Min.: 1
Wielokr.: 1

Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25Oczekiwane: 12.10.2026
Min.: 1
Wielokr.: 1

Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25Oczekiwane: 20.10.2026
Min.: 1
Wielokr.: 1

Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
22Oczekiwane: 09.11.2026
Min.: 1
Wielokr.: 1

Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25Oczekiwane: 19.10.2026
Min.: 1
Wielokr.: 1

Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25Oczekiwane: 20.10.2026
Min.: 1
Wielokr.: 1

Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Oczekiwane: 21.09.2026
Min.: 1
Wielokr.: 1

Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Oczekiwane: 20.10.2026
Min.: 1
Wielokr.: 1

Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Oczekiwane: 19.10.2026
Min.: 1
Wielokr.: 1

Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Oczekiwane: 19.10.2026
Min.: 1
Wielokr.: 1

Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Oczekiwane: 19.10.2026
Min.: 1
Wielokr.: 1

Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Oczekiwane: 20.10.2026
Min.: 1
Wielokr.: 1

Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Oczekiwane: 07.10.2026
Min.: 1
Wielokr.: 1

Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Oczekiwane: 20.10.2026
Min.: 1
Wielokr.: 1

Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Oczekiwane: 19.10.2026
Min.: 1
Wielokr.: 1

Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Oczekiwane: 19.10.2026
Min.: 1
Wielokr.: 1

Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
22Oczekiwane: 19.10.2026
Min.: 1
Wielokr.: 1

Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Oczekiwane: 19.10.2026
Min.: 1
Wielokr.: 1

Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Oczekiwane: 20.10.2026
Min.: 1
Wielokr.: 1

Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Oczekiwane: 20.10.2026
Min.: 1
Wielokr.: 1

Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Oczekiwane: 20.10.2026
Min.: 1
Wielokr.: 1

Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Oczekiwane: 20.10.2026
Min.: 1
Wielokr.: 1

Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25Oczekiwane: 14.09.2026
Min.: 1
Wielokr.: 1

Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket Niedostępne na stanie, czas realizacji zamówienia 10 tygodni
Min.: 350
Wielokr.: 1

Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6