Samtec XCede® HD HPTS 3.20mm Power Modules
Samtec XCede® HD 3.20mm HPTS Power Modules feature press-fit tails, vertical mounts, and come in a variety of body heights to match signal module pair count. These modules consist of a 12.3A per pin current rating and mount individually to the backplane. Samtech XCede HD HPTS Power Modules are designed using Copper alloy contact material and black PolyPhenylene Sulfide (PPS) insulator material.
Features
- Mounts individually to backplane
- Variety of body heights to match signal module pair count
- Press-fit tails
- Vertical mount
- 12.3A per pin current rating
- Copper alloy contact material
- Polyphenylene Sulfide (PPS) insulator material
Dimensions (mm)
Associated Connectors
Samtec XCede® HD High-Density Backplane Systems
Combine a small form factor with incredible design flexibility for system and board space savings.
Samtec XCede® HD HDTM 1.8mm Vertical Backplane Headers
Features a 1.8mm column pitch, keying, guidance, and up to 3mm contact wipe on signal pins.
Samtec XCede® HD HDTF Right-Angle Backplane Receptacles
Features a 1.8mm column pitch and modular design for flexibility in applications.
Opublikowano: 2019-04-29
| Zaktualizowano: 2023-07-18