Renesas / Dialog SLG47115V-DIP Proto Board
Renesas / Dialog SLG47115V-DIP Proto Board is a small PCB that adapts the SLG47115V HVPAK™ (High-Voltage GreenPAK™) Mixed-Signal Matrix TQFN package into a DIP footprint. The SLG47115V-DIP Proto Board can speed design by enabling easy breadboarding and prototyping.
The Dialog Semiconductor SLG47115V-DIP Proto Board requires GreenPAK DIP Adapter (SLG4SA-DIP) to use with the SLG4DVKADV GreenPAK™ Advanced Development Board.
Features
- Perfect for breadboarding and fast prototypes
- Simplifies prototyping of SMT ICs
- 20-pin DIP footprint with 0.3" width
- Four high voltage high current output GPOs
- Current up to 1A per HV GPO
- Current sensing resistors
- Optional VDD LED indicator
- Decoupling capacitor included
- Screw terminals for high voltage high and current lines
- Optional I2C pull-up resistors
Related Development Tools
Renesas / Dialog Zaawansowana płyta programistyczna SLG4DVKADV GreenPAK™
Umożliwia kompletne programowanie, emulację i testowanie urządzeń GreenPAK™.
Renesas / Dialog SLG47115V-SKT Socket Board
Enables users to configure the SLG47115V HVPAK™ device using the SLG4DVKADV Development Board.
Renesas / Dialog SLG47115V-EVB Evaluation Board
Demonstration and development platform for the SLG47115V HVPAK™ Mixed-Signal Matrix.
Opublikowano: 2022-09-15
| Zaktualizowano: 2023-05-08