5G Automotive & Transportation Solutions

Samtec 5G Automotive and Transportation Connectivity meets the needs of the growing 5G network market. As implementation of the 5G network quickly gains momentum, high-performance devices, systems, and test and measurement equipment are needed to support the ultra-high frequencies and high data rates that technologies like mmWave, Massive MIMO, beamforming, and full duplex demand. Samtec offers high-performance interconnects and high-level technical expertise to support these requirements, including an expanding portfolio of solutions ideal for Automotive applications.

Wyniki: 4 277
Wybierz Obraz Nr części
 Produc.
Opis Karta charakterystyki Dostępność Wycena (PLN) Filtruj wyniki w tabeli wg ceny jednostkowej zależnej od ilości.
Il. RoHS Model ECAD Produkt
Liczba pozycji
Skok
Liczba rzędów
Styl styku
Kąt montażu
Wysokość stosu
Prąd znamionowy
Napięcie znamionowe
Maksymalna szybkość transmisji danych
Minimalna temperatura robocza
Maksymalna temperatura robocza
Pokrycie styku
Materiał styku
Materiał oprawy
Seria
Opakowanie
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
97Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 75

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 14 mm, 15 mm, 15.5 mm, 16.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 1.27MM SEARAY HS HD TERM ARRAY
Karta charakterystyki
329Na stanie magazynowym
Dostępność opcji MouseReel
Min.: 1
Wielokr.: 1
Szpula: 475

Headers 40 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape, MouseReel
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
224Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 325

Headers 40 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
213Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 225

Headers 320 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.80 mm Q Strip High-Speed Ground Plane Socket Strip
Karta charakterystyki
1 005Na stanie magazynowym
Dostępność opcji MouseReel
Min.: 1
Wielokr.: 1
Szpula: 550

Connectors 40 Position 0.8 mm (0.031 in) 2 Row Solder Straight 5 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSE Reel, Cut Tape, MouseReel
Samtec Board to Board & Mezzanine Connectors 0.50 mm Q Strip High-Speed Ground Plane Socket Strip
Karta charakterystyki
91Na stanie magazynowym
Min.: 1
Wielokr.: 1

Sockets 60 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 A 175 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSH Tray
Samtec Board to Board & Mezzanine Connectors 0.50 mm Q Strip High-Speed Ground Plane Socket Strip
Karta charakterystyki
116Na stanie magazynowym
Min.: 1
Wielokr.: 1

Sockets 120 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 A 175 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSH Tray
Samtec Board to Board & Mezzanine Connectors 0.635 mm Q Strip High-Speed Ground Plane Socket Strip
Karta charakterystyki
592Na stanie magazynowym
Dostępność opcji MouseReel
Min.: 1
Wielokr.: 1
Szpula: 475

Sockets 100 Position 0.635 mm (0.025 in) 2 Row Solder Straight 1.8 A 285 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSS Reel, Cut Tape, MouseReel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Q Strip High-Speed Ground Plane Socket Strip
Karta charakterystyki
426Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 475

Sockets 150 Position 0.635 mm (0.025 in) 2 Row Solder Straight 1.8 A 285 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSS Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors Q Strip High-Speed Ground Plane Header
Karta charakterystyki
199Na stanie magazynowym
Min.: 1
Wielokr.: 1

Headers 40 Position 0.8 mm (0.031 in) 2 Row Solder Straight 5 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Board to Board & Mezzanine Connectors 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Karta charakterystyki
739Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 300

Headers 60 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 8 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Karta charakterystyki
479Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 425

Headers 120 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 5 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Karta charakterystyki
690Na stanie magazynowym
Min.: 1
Wielokr.: 1

Headers 120 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 11 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Tray
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
639Na stanie magazynowym
Dostępność opcji MouseReel
Min.: 1
Wielokr.: 1
Szpula: 250

Sockets 400 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape, MouseReel
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
176Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 325

Sockets 200 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
160Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 225

Headers 180 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
314Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 125

Headers 240 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 12 mm, 13 mm, 13.5 mm, 14.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
499Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 200

Headers 240 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
101Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 100

Headers 240 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 16 mm, 17 mm, 17.5 mm, 18.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
231Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 350

Headers 200 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
222Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 225

Sockets 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 1.27MM SEARAY HS HD OPEN TERM
Karta charakterystyki
347Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 200

Headers 150 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.50 mm Q Strip High-Speed Ground Plane Socket Strip
Karta charakterystyki
368Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 500

Sockets 80 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 A 175 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSH Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors Q Strip High-Speed Ground Plane Header
Karta charakterystyki
162Na stanie magazynowym
Min.: 1
Wielokr.: 1

Connectors 120 Position 0.8 mm (0.031 in) 2 Row Solder Straight 8 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Board to Board & Mezzanine Connectors 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Karta charakterystyki
1 601Na stanie magazynowym
Min.: 1
Wielokr.: 1

Headers 120 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 8 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Tray