5G Automotive & Transportation Solutions

Samtec 5G Automotive and Transportation Connectivity meets the needs of the growing 5G network market. As implementation of the 5G network quickly gains momentum, high-performance devices, systems, and test and measurement equipment are needed to support the ultra-high frequencies and high data rates that technologies like mmWave, Massive MIMO, beamforming, and full duplex demand. Samtec offers high-performance interconnects and high-level technical expertise to support these requirements, including an expanding portfolio of solutions ideal for Automotive applications.

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Opakowanie
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
129Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 75

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 16 mm, 17 mm, 17.5 mm, 18.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
613Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 225

Headers 300 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.50 mm Q Strip High-Speed Ground Plane Socket Strip
Karta charakterystyki
136Na stanie magazynowym
Min.: 1
Wielokr.: 1

Sockets 40 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 A 175 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSH Tray
Samtec Board to Board & Mezzanine Connectors 0.50 mm Q Strip High-Speed Ground Plane Socket Strip
Karta charakterystyki
2 217Na stanie magazynowym
Dostępność opcji MouseReel
Min.: 1
Wielokr.: 1
Szpula: 525

Sockets 60 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 A 175 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSH Reel, Cut Tape, MouseReel
Samtec Board to Board & Mezzanine Connectors 0.50 mm Q Strip High-Speed Ground Plane Socket Strip
Karta charakterystyki
315Na stanie magazynowym
Min.: 1
Wielokr.: 1

Sockets 120 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 A 175 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSH Tray
Samtec Board to Board & Mezzanine Connectors 0.50 mm Q Strip High-Speed Ground Plane Socket Strip
Karta charakterystyki
116Na stanie magazynowym
Min.: 1
Wielokr.: 1

Sockets 300 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 A 175 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSH Tray
Samtec Board to Board & Mezzanine Connectors Q Strip High-Speed Ground Plane Header
Karta charakterystyki
544Na stanie magazynowym
Min.: 1
Wielokr.: 1

Headers 40 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 16 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Board to Board & Mezzanine Connectors 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Karta charakterystyki
390Na stanie magazynowym
Min.: 1
Wielokr.: 1

Headers 40 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 16 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Tray
Samtec Board to Board & Mezzanine Connectors 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Karta charakterystyki
261Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 150

Headers 120 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 11 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Karta charakterystyki
55Na stanie magazynowym
Min.: 1
Wielokr.: 1

Headers 240 Position 0.5 mm (0.02 in) 2 Row Solder Straight 25 mm 2 A 175 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Tray
Samtec Board to Board & Mezzanine Connectors 0.635 mm Q Strip High-Speed Ground Plane Terminal Strip
Karta charakterystyki
186Na stanie magazynowym
Min.: 1
Wielokr.: 1

Headers 50 Position 0.635 mm (0.025 in) 2 Row Solder Straight 1.8 A 285 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTS Tray
Samtec Board to Board & Mezzanine Connectors 0.635 mm Q Strip High-Speed Ground Plane Terminal Strip
Karta charakterystyki
353Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 425

Headers 100 Position 0.635 mm (0.025 in) 2 Row Solder Straight 1.8 A 285 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTS Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
150Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 150

Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 12 mm, 13 mm, 13.5 mm, 14.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
279Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 225

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
165Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 225

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
343Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 325

Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
225Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 200

Headers 400 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
222Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 225

Sockets 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 1.27MM SEARAY HS HD OPEN TERM
Karta charakterystyki
347Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 200

Headers 150 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.50 mm Q Strip High-Speed Ground Plane Socket Strip
Karta charakterystyki
368Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 500

Sockets 80 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 A 175 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSH Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors Q Strip High-Speed Ground Plane Header
Karta charakterystyki
162Na stanie magazynowym
Min.: 1
Wielokr.: 1

Connectors 120 Position 0.8 mm (0.031 in) 2 Row Solder Straight 8 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Board to Board & Mezzanine Connectors 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Karta charakterystyki
1 601Na stanie magazynowym
Min.: 1
Wielokr.: 1

Headers 120 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 8 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Tray
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
472Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 325

Sockets 120 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
403Na stanie magazynowym
Dostępność opcji MouseReel
Min.: 1
Wielokr.: 1
Szpula: 200

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 11 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape, MouseReel
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
100Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 100

Headers 120 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 16 mm, 17 mm, 17.5 mm, 18.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape