VPG Foil Resistors VSMP Resistors
VPG Foil Resistors VSMP Wraparound SMD Chip Resistors use ultra-high-precision Bulk Metal® Z-Foil technology, which provides a significant reduction in the resistive element's sensitivity to ambient temperature variations (TCR) and to self-heating when power is applied (power coefficient). The full wraparound termination ensures safe handling during the manufacturing process and provides stability during multiple thermal cyclings. Additional features include a high power rating, excellent load-life stability, extremely low TCR, low noise, and tight tolerances. VPG Foil Resistors VSMP Wraparound SMD Chip Resistors are available in case sizes 0603, 0805, 1206, 2010, and 2512.
Features
- Temperature coefficient of resistance (TCR) 0.2ppm/°C typical (–55°C to +125°C, +25°C ref.)
- Resistance tolerance to ±0.01%
- Power coefficient "∆R due to self-heating" at 5ppm at rated power
- Power rating to 750mW at +70°C
- Load life stability to ±0.005% at 70°C, 2000h at rated power
- 5Ω to 125kΩ resistance range
- Thermal stabilization time <1s (nominal value achieved within 10ppm of steady state value)
- Electrostatic discharge (ESD) at least to 25kV
- ≤0.005% short time overload
- Non-inductive, non-capacitive design
- 1ns effectively no ringing rise time
- 0.010μVRMS/V of applied voltage (<–40dB) current noise
- Voltage coefficient <0.1ppm/V (resistance values above 10kΩ)
- <0.08μH non-inductive
- Non-hotspot design
- Lead free, tin/lead alloy terminal finishes
- Screening in accordance with EEE-INST-002, and MIL-PRF-55342 available
Applications
- Automatic test equipment (ATE)
- High precision instrumentation
- Laboratory, industrial, and medical
- Audio
- Electron beam scanning and recording equipment, and electron microscopes
- Downhole instrumentation
- Communication
Opublikowano: 2011-10-05
| Zaktualizowano: 2026-04-13