TE Connectivity MULTI-BEAM Card Edge Connectors

TE Connectivity's MULTI-BEAM Card Edge Connectors deliver leading power and signal performance to address server market requirements for performance, profile, and cost-effectiveness. These connectors are also ideal for global data communication applications. TE MULTI-BEAM Card Edge Connectors offer signal space savings of up to 60% compared to existing SEC-II power card edge designs and a 30% power density improvement over legacy products. This TE card edge connector series also offers a current rating of 43A maximum for power contacts. The scalable and modular features of these connectors support high flexibility in configuration and PCB design.

Features

  • High density
    • Up to 60% signal space savings
    • 30% power density improvement over legacy products
  • High Connectivity tolerance
    • High gatherability for blind-mate applications, ±2.0mm (X), ±1.54mm (Y)
    • More clearance between PCB pads for signal contact to prevent solder bridging and 1.3mm larger pads for easier alignment
    • Supports 1.57mm and 2.36mm PCB thickness
  • Modular design
    • Common power and signal contact module
    • Flexible configuration with different contact quantities and positions
    • High scalability (AC and DC, low power and high power)
  • High performance
    • Excellent mechanical and electrical performance
    • Easy mating/un-mating with proper retention force
    • Low-level contact resistance

Specifications

  • Current rating
    • Up to 43A (power contact)
    • Up to 2A (signal contact)
  • Voltage rating
    • 100V maximum (power)
    • 60V maximum (signal)
  • 200 mating cycles durability
  • EIA-364-27 mechanical shock
  • EIA-364-28 vibration
  • -55°C to +105°C operating temperature range
  • Low mating force
  • 6N maximum per power contact
  • 1.5N maximum per signal contact

Applications

  • Datacenter
  • Telecommunications
  • Industrial automation
  • Power systems
Opublikowano: 2017-07-12 | Zaktualizowano: 2026-01-12