4 Gbit Memory ICs

Results: 306
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Description Datasheet Availability Pricing (PLN) Filter the results in the table by unit price based on your quantity.
Qty. RoHS Product
Product Type
Mounting Style
Package/Case
Memory Size
Interface Type
GigaDevice GD5F4GM8UEBIGY
GigaDevice NAND Flash
Datasheet
Non-Stocked
Min.: 4 800
Mult.: 4 800

NAND Flash SMD/SMT TFBGA-24 4 Gbit DTR/Dual/Quad SPI, SPI
GigaDevice GD5F4GM8UEYJGR
GigaDevice NAND Flash
Datasheet
Non-Stocked
Min.: 3 000
Mult.: 3 000
: 3 000

NAND Flash SMD/SMT WSON-8 4 Gbit DTR/Dual/Quad SPI, SPI
GigaDevice GD9FS4G8F4DLGI
GigaDevice NAND Flash
Datasheet
Non-Stocked
Min.: 2 100
Mult.: 2 100

NAND Flash SMD/SMT FBGA-63 4 Gbit Parallel
GigaDevice GD9FS4G8F4DMGI
GigaDevice NAND Flash
Datasheet
Non-Stocked
Min.: 960
Mult.: 960

NAND Flash SMD/SMT TSOP-I-48 4 Gbit Parallel
GigaDevice GD9FU4G8F3ALGJ
GigaDevice NAND Flash Non-Stocked
Min.: 2 100
Mult.: 2 100

NAND Flash SMD/SMT FBGA-63 4 Gbit Parallel
GigaDevice GD9FU4G8F3AMG2
GigaDevice NAND Flash Non-Stocked
Min.: 960
Mult.: 960

NAND Flash SMD/SMT TSOP-I-48 4 Gbit Parallel
GigaDevice GD9FU4G8F3AMGJ
GigaDevice NAND Flash Non-Stocked
Min.: 960
Mult.: 960

NAND Flash SMD/SMT TSOP-I-48 4 Gbit Parallel
GigaDevice GD9FU4G8F4DLGI
GigaDevice NAND Flash
Datasheet
Non-Stocked
Min.: 2 100
Mult.: 2 100

NAND Flash SMD/SMT FBGA-63 4 Gbit Parallel
GigaDevice GD9FU4G8F4DMGI
GigaDevice NAND Flash
Datasheet
Non-Stocked
Min.: 960
Mult.: 960

NAND Flash SMD/SMT TSOP-I-48 4 Gbit Parallel
Zentel Japan DRAM DDR3&DDR3L 4Gb, 512Mx8, 1866 at CL13, 1.35V&1.5V, FBGA-78
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 2 420
Mult.: 2 420

DRAM SMD/SMT FPGA-78 4 Gbit
Zentel Japan DRAM DDR3&DDR3L 4Gb, 512Mx8, 1866 at CL13, 1.35V&1.5V, FBGA-78, Ind. Temp.
Datasheet
Non-Stocked Lead-Time 20 Weeks
Min.: 2 420
Mult.: 2 420

DRAM SMD/SMT FPGA-78 4 Gbit
Zentel Japan DRAM DDR3 4Gb, 512Mx8, 2133 at CL14, 1.5V, FBGA-78
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 2 420
Mult.: 2 420

DRAM SMD/SMT FPGA-78 4 Gbit
Zentel Japan DRAM DDR3 4Gb, 512Mx8, 2133 at CL14, 1.5V, FBGA-78, Ind. Temp.
Datasheet
Non-Stocked Lead-Time 28 Weeks
Min.: 2 420
Mult.: 2 420

DRAM SMD/SMT FPGA-78 4 Gbit
Zentel Japan DRAM DDR3L 4Gb, 512Mx8, 2133 at CL14, 1.35V, FBGA-78
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 2 420
Mult.: 2 420

DRAM SMD/SMT FPGA-78 4 Gbit
Zentel Japan DRAM DDR3&DDR3L 4Gb, 256Mx16, 1866 at CL13, 1.35V&1.5V, FBGA-96
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 2 090
Mult.: 2 090

DRAM SMD/SMT FPGA-96 4 Gbit
Zentel Japan DRAM DDR3&DDR3L 4Gb, 256Mx16, 1866 at CL13, 1.35V&1.5V, FBGA-96, Ind. Temp.
Datasheet
Non-Stocked Lead-Time 20 Weeks
Min.: 2 090
Mult.: 2 090

DRAM SMD/SMT FPGA-96 4 Gbit
Zentel Japan DRAM DDR3 4Gb, 256Mx16, 2133 at CL14, 1.5V, FBGA-96
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 2 090
Mult.: 2 090

DRAM SMD/SMT FPGA-96 4 Gbit
Zentel Japan DRAM DDR3 4Gb, 256Mx16, 2133 at CL14, 1.5V, FBGA-96, Ind. Temp.
Datasheet
Non-Stocked Lead-Time 28 Weeks
Min.: 2 090
Mult.: 2 090

DRAM SMD/SMT FPGA-96 4 Gbit
Zentel Japan DRAM DDR3L 4Gb, 256Mx16, 2133 at CL14, 1.35V, FBGA-96
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 2 090
Mult.: 2 090

DRAM SMD/SMT FPGA-96 4 Gbit
ISSI DRAM 4G, 1.2V, DDR4, 256Mx16, 2400MT/s at 16-16-16, 96 ball BGA (7.5mm x13.5mm) RoHS, T&R
Datasheet
Non-Stocked Lead-Time 52 Weeks
Min.: 2 500
Mult.: 2 500
: 2 500
DRAM SMD/SMT BGA-96 4 Gbit
ISSI DRAM 4G, 1.2V, DDR4, 256Mx16, 2400MT/s at 16-16-16, 96 ball BGA (7.5mm x13.5mm) RoHS, IT, T&R
Datasheet
Non-Stocked Lead-Time 52 Weeks
Min.: 2 500
Mult.: 2 500
: 2 500

DRAM SMD/SMT BGA-96 4 Gbit
ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 1.06-1.17/1.70-1.95V, LPDDR4, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R
Datasheet
Non-Stocked Lead-Time 52 Weeks
Min.: 2 500
Mult.: 2 500
: 2 500

DRAM SMD/SMT BGA-200 4 Gbit
ISSI DRAM Automotive (Tc: -40 to +105C), 4G, 1.06-1.17/1.70-1.95V, LPDDR4, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R
Datasheet
Non-Stocked Lead-Time 52 Weeks
Min.: 2 500
Mult.: 2 500
: 2 500

DRAM SMD/SMT BGA-200 4 Gbit
ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS
Datasheet
Non-Stocked Lead-Time 52 Weeks
Min.: 136
Mult.: 136

DRAM SMD/SMT BGA-200 4 Gbit
ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R
Datasheet
Non-Stocked Lead-Time 52 Weeks
Min.: 2 500
Mult.: 2 500
: 2 500

DRAM SMD/SMT BGA-200 4 Gbit