Chirp Products

TDK InvenSense Chirp Products are a family of miniature and ultra-low power ultrasonic Time-of-Flight (ToF) range sensors and modules based on MEMS technology. These sensors feature a system-in-package that integrates a Piezoelectric Micromachined Ultrasonic Transducer (PMUT) with an ultra-low-power System on Chip (SoC) in a miniature, reflowable package. The CH101 and the CH201 sensors can detect multiple objects, work in any lighting conditions, including full sunlight, and provide millimeter-accurate range measurements. The Chirp family products include ultrasonic sensor modules, development kits, and software, depending on the application requirements.

Wszystkie wyniki (7)

Wybierz Obraz Nr części Produc. Opis Karta charakterystyki Dostępność Wycena (PLN) Filtruj wyniki w tabeli wg ceny jednostkowej zależnej od ilości. Il. RoHS
TDK InvenSense Distance Sensor ICs & Embedded Modules Ultra-low Power Integrated Ultrasonic Time-of-Flight Range Sensor for Pitch-Catch Applications 1 743Na stanie magazynowym
Min.: 1
Wielokr.: 1
: 1 000

TDK InvenSense Distance Sensor ICs & Embedded Modules Ultra-low Power Integrated Ultrasonic Time-of-Flight Range Sensor for Pulse-Echo Applications 1 208Na stanie magazynowym
Min.: 1
Wielokr.: 1
: 1 000

TDK InvenSense Distance Sensor ICs & Embedded Modules Long Range Ultra-low Power Ultrasonic Time-of-Flight Range Sensor Pulse-Echo Applications 6 032Na stanie magazynowym
Min.: 1
Wielokr.: 1
: 1 000


TDK InvenSense Distance Sensor Development Tool Chirp Developmnt Kit 10Na stanie magazynowym
Min.: 1
Wielokr.: 1

TDK InvenSense Distance Sensor Development Tool Development Board for CH201-00ABR 3Na stanie magazynowym
Min.: 1
Wielokr.: 1

TDK InvenSense Distance Sensor Development Tool 48Na stanie magazynowym
Min.: 1
Wielokr.: 1

TDK InvenSense Distance Sensor Development Tool Ultra-low Power Ultrasonic Time-of-Flight Range Evaluation Module with 45FoV 39Na stanie magazynowym
Min.: 1
Wielokr.: 1