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Heat Sinks Standard heatspreader for COM-HPC module conga-HPC/cALS with integrated heat pipes, 13mm height. All standoffs are with 2.7mm bore hole.

CPU & Chip Coolers Standard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Through hole mounting with bore hole standoffs 2.7mm.

Modules Accessories Heat pipe Adapter for COM-HPC Server modules conga-HPC/sILL. Suitable for standard 8 mm heat pipes to optimize heat distribution. Threaded mounting with threaded standoffs M2.5.

Heat Sinks Standard heatspreader for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5.

CPU & Chip Coolers Standard passive cooling solution for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes, 18.2mm overall cooling height.

Heat Sinks Standard heatspreader for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs 2.7mm.

Computer-On-Modules - COM COM-HPC Size A module based on Intel Core i3-1220PE processor with 4 P-cores 1.5GHz up to 4.2GHz and 4 E-cores 1.1GHz up to 3.1GHz, 12MB Intel Smart Cache, Intel UHD Graphics with 48EUs, Dual channel DDR5 4800 MT/s memory interface, Intel code n

Computer-On-Modules - COM COM-HPC Size A module based on Intel Core i5-1250PE processor with 4 P-cores 1.7GHz up to 4.4GHz and 8 E-cores 1.2GHz up to 3.2GHz, 12MB Intel Smart Cache, Intel Iris Xe Graphics architecture with 80EUs, Dual channel DDR5 4800 MT/s memory interfa

Computer-On-Modules - COM COM-HPC Size A module based on Intel Core i3-1215UE processor with 2 P-cores 1.2GHz up to 4.4GHz and 4 E-cores 0.9GHz up to 3.3GHz, 10MB Intel Smart Cache, Intel UHD Graphics with 64EUs, Dual channel DDR5 4800 MT/s memory interface, Intel code n

CPU & Chip Coolers Starterkit for SMARC 2.0 with SMARC module based on Intel Atom E3900 processor series. Includes congatec SMARC evaluation carrier board conga-SEVAL, SMARC module conga-SA5, cooling solution, adapters and cables.

Heat Sinks Heat spreader solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.

Computer-On-Modules - COM SMARC 2.1 module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM Cortex-A53 @1.8GHz +1x ARM Cortex-M7 + NPU, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Commercial grade temperature range from 0 C to 60 C.