NXP Semiconductors RD33771CNTREVM Reference Design Board

NXP Semiconductors RD33771CNTREVM Reference Design Board provides a solution for a centralized and distributed architecture for lithium-ion battery management in automotive applications. This board allocates four MC33771C devices controlled by one MCU, which can be bypassed and stacked to a long daisy chain for a flexible battery management system (BMS) architecture. The battery cell controllers (BCCs) communicate by TPL daisy-chain or capacitor isolation, and each BCC can measure lithium batteries having 7 to 14 cells each. NXP RD33771CNTREVM Reference Design Board features a one-channel CAN interface and JTAG debugging interface. Applications include a mixed centralized-distributed architecture BMS for eCar and eBus applications. 

Features

  • 4x BCCs onboard
    • Each BCC can measure voltage for up to 14 battery cells with high accuracy
    • Each BCC has 6-channel temperature sensing
    • First BCC has current-sensing point and could connect external SHUNT resistor for current measurement
  • Capacitor or TPL isolation communication onboard
  • TPL isolation for off-board communication
  • Cell balancing current set to 100mA, expandable up to 300mA by adding CB resistors
  • Low-cost SBC and MCU as BCC management
  • 1-channel CAN interface
  • JTAG debugging interface
  • High EMC performance, passed BCI 200mA, CE CISPR class 3

Specifications

  • Analog front-end (ASIL-D)
    • 4 BCC devices onboard
    • Transformer/capacitor isolation between each BCC
    • 14 battery cells voltage measurement at each AFE
    • 7 temperature channels measurement at each AFE
    • Daisy chain-link other board(s) for flexible architecture
  • S32K144 microcontroller (ASIL-B) manages all AFEs onboard
  • Power management
    • Power supply with watchdog support
    • Overvoltage/Undervoltage detection support
  • Connectivity includes CAN interface, capacitor /transformer isolation-based TPL daisy chain for off-board

Kit Contents

  • Battery simulation cable for each AFE module
  • Low-voltage cable for the MCU module
  • Twisted daisy-chain cable for connecting other possible board
  • Needs external 12VDC supplier for MCU part
  • Needs external 12VDC to 50VDC supplier for all AFEs
  • Additional hardware
    • Power supply 12VDC with 500mA current capability 
    • Power supply 10 to 50VDC with 500mA current capability or a 7-to-14-cell battery pack
    • USB Multilink FX debug probe

Block Diagram

Block Diagram - NXP Semiconductors RD33771CNTREVM Reference Design Board

Typical System Configuration

NXP Semiconductors RD33771CNTREVM Reference Design Board
Opublikowano: 2020-05-06 | Zaktualizowano: 2024-12-30