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Würth Elektronik Thermal Interface Kits

Würth Elektronik Thermal Interface Kits offer a range of products for engineers to use during prototype development. The 400001 Kit is designed for vertical thermal interfaces and contains a WE-TGF Silicone Gap Filler Pad, WE-TINS Thermally Conductive Insulator, WE-PCM Phase Changing Material, and WE-TTT Thermal Transfer Tape. These products fill a gap and provide a path that allows the heat energy to flow. The 400002 Kit is designed for heat spreading interfaces and includes a WE-TGFG Graphite Foam Gasket and WE-TGS Graphite Sheet. These products help to distribute heat evenly throughout the surface of cooling assemblies. Würth Elektronik Thermal Interface Kits allows designers a variety of samples to test in designs.

Kit Contents

  • 400001 Kit 
    • For vertical thermal interfaces, fills a gap and provides a path that allows the heat energy to flow
    • WE-TGF Silicone Gap Filler Pad
      • 1W/mK to 10W/mK thermal conductivity
      • 0.5mm to 18mm thickness
    • WE-TINS Thermally Conductive Insulator
      • K:1.6W/mK to 3.5W/mK thermal conductivity
      • 0.23mm thickness
    • WE-PCM Phase Changing Material
      • 1.6W/mK to 5W/mK thermal conductivity
      • 0.2mm thickness
    • WE-TTT Thermal Transfer Tape
      • 1W/mK thermal conductivity
      • 0.2mm thickness
  • 400002 Kit 
    • For heat spreading interfaces, distributes heat evenly throughout the surface of cooling assemblies
    • WE-TGFG Graphite Foam Gasket
      • 400W/mK thermal conductivity
      • 1.5mm to 25mm thickness
    • WE-TGS Graphite Sheet
      • 1800 W/mK thermal conductivity
      • 0.03mm thickness

Datasheets

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Opublikowano: 2021-09-28 | Zaktualizowano: 2022-03-11