Powrót do: Winbond

Winbond Low Power HYPERRAM®

Winbond Low Power HYPERRAMs® are mobile DRAM with a high-speed SDRAM device internally configured as an 8-bank memory and uses a Double Data Rate (DDR) architecture on the Command/Address (CA) bus. This HYPERRAM features low pin count, low power consumption, and easy control to improve the performance of end devices. These IoT edge devices and human-machine interface devices require functionality in size, power consumption, and performance. These HYPERRAM memory devices provide technical solutions and address the rapid rise of IoT edge devices and human-machine interface devices. These HYPERRAMs offer 45mW power at 1.8V in hybrid sleep mode, significantly different from the standby mode of SDRAM. The HYPERRAM supports the HyperBus interface and is a solution to address the rapid rise of automotive electronics, industrial 4.0, and smart home applications.

For IoT applications, various design considerations such as low cost, low power consumption, and computing efficiency must be met to gain widespread adoption in the market. From the overall system design and product life perspective, HYPERRAM™ has become an ideal choice for emerging IoT devices.

Features

  • HyperBus interface
  • Power supply
    • 1.7V~1.95V
    • 2.7V~3.6V
  • Maximum clock rate
    • 166MHz
    • 200MHz
  • Double-Data Rate (DDR) up to 333MT/s or 400MT/s
  • Clock (differential clock (CK/CK#))
  • Chip Select (CS#)
  • 8-bit data bus (DQ[7:0])
  • Read-Write Data Strobe (RWDS)
    • Bidirectional data strobe/mask
    • Output at the start of all transactions to indicate refresh latency
    • Output during read transactions as read data strobe
    • Input during write transactions as write data mask
  • -40°C to 85°C operating temperature range
  • Configurable output drive strength
  • Configurable burst characteristics
  • Wrapped burst lengths
    • 16bytes (8 clocks)
    • 32bytes (16 clocks)
    • 64bytes (32 clocks)
    • 128bytes (64 clocks)
  • Power saving modes
    • Hybrid sleep mode
    • Deep power down

Applications

  • Automotive electronics
  • Industrial 4.0
  • Smart home applications
  • IoT devices
  • Human-machine interface devices

Block Diagram

Block Diagram - Winbond Low Power HYPERRAM®
Opublikowano: 2020-03-11 | Zaktualizowano: 2025-01-06