TDK InvenSense MOD_CH201 Distance Sensor Module
TDK InvenSense MOD_CH201 Distance Sensor Module is designed for the CH201 distance sensor. The CH201 sensor is a miniature, ultra-low power, and long-range ultrasonic Time-of-Flight (ToF) range sensor based on Chirp’s patented MEMS technology. This sensor comes in a system-in-package that integrates Piezoelectric Micromachined Ultrasonic Transducer (PMUT) with an ultra-low-power System on Chip (SoC) in a miniature, reflowable package. The sensor module board incorporates a CH201 ultrasonic sensor device with a 45° FoV acoustic housing assembly, a capacitor, and an FFC connector.Features
- Fast and accurate range-finding
- Operating range from 20cm to 5m
- Programmable modes optimized for long- or short-range sensing applications
- Customizable Field of View (FoV) up to 180°
- Multi-object detection
- Works in any lighting condition, including full sunlight to complete darkness
- Insensitive to object color, detects optically transparent surfaces (glass, clear plastics, etc.)
- Easy to integrate
- Single sensor for receive and transmit
- 1.8V single supply voltage
- I2C fast mode compatible interface and data rates up to 400kHz
- Dedicated programmable range interrupt pin
- Platform-independent software driver enables turnkey range-finding
- Miniature integrated package
- Compatible with standard SMD reflow
- Low-power SoC running advanced ultrasound firmware
- -40°C to +85°C operating temperature range
- Ultra-low supply current
- 1 sample/s
- 7.5µA (1m max range)
- 13.5µA (5m max range)
- 25 samples/s
- 63µA (1m max range)
- 247µA (5m max range)
- 1 sample/s
Applications
- User presence in-home/building automation and personal electronics
- Obstacle avoidance
- Robotics and drones
- Ultra-low-power remote presence-sensing node
- Augmented/virtual reality and gaming
- Gesture control
- Liquid level sensing and shelf inventory monitoring
Specifications
- 1.62V to 1.98V operating voltage range
- 3.5mm x 3.5mm x 1.26mm dimensions
- 8-pin LGA package
- 60ms programming time
Additional Resource
Opublikowano: 2020-09-07
| Zaktualizowano: 2024-09-03
