STMicroelectronics ST4SIM-200M eSIM GSMA System-on-Chip (SoC)

STMicroelectronics ST4SIM-200M eSIM GSMA System-on-Chip (SoC) is designed to manage various MNO profiles and ensures the appropriate security level to all eSIM stakeholders. The stakeholders include users, MNO, OEMs, hardware integrators, and service providers. This SoC can include an embedded secure element to store credentials and/or independent applications directly managed by the MCU or by another OEM element. The ST4SIM-200M eSIM GSMA SoC provides a secure and interoperable Java® Card environment compliant with Java Card v3.0.4 classic. This SoC integrates the most advanced UICC features compliant with GlobalPlatform®, ETSI, 3GPP, and 3GPP2 specifications. 

The ST4SIM-200M eSIM GSMA SoC is based on the ST33G1M2M industrial-grade hardware solution (JEDEC) that s a tamper-resistant secure element certified by Common Criteria EAL5+. This solution comes with a powerful 32-bit Arm® SecurCore® SC300™ RISC core. This SoC implements various security features including DES/3DES/AES symmetric cryptography, RSA (up to 2048 bits) asymmetric cryptography, and HTTPS remote management TLS v1.0, v1.1, and v1.2. Other security features include elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brain pool P256r1. Authentication algorithms include MILEAGE, TUAK, and CAVE. Typical applications include cellular-connected nodes, Cat M1 and NBIoT LTE, surveillance, IoT for smart-homes and cities such as gas-metering, and IoT for smart industries.

Features

  • Remote SIM provisioning compliant with GSMA M2M and SIMalliance specifications
  • Bootstrap connectivity profile provided by a trusted partner
  • Up to 7 connectivity profiles (depending on memory size)
  • Compliant with 2G / 3G / 4G (LTE) / CDMA / NB-IoT / CAT–M networks
  • Network access applications supported: SIM / USIM / ISIM / CSIM
  • Secure element access control (ARF / PKCS#15)
  • OTA capability over SMS, CAT-TP, and HTTPS (including DNS)
  • Multi-interfaces able to combine eSIM + eSE
  • ECOPACK-compliant packages:
    • 2FF, 3FF, or 4FF plugin card (based on D16 micromodule)
    • 5mm × 6mm VFDFPN8 with wettable flank (MFF2)
    • WLCSP11

Specifications

  • Hardware:
    • Product available on ST33G1M2M
    • ST33 product based on a 32-bit Arm SecurCore SC300™ RISC core
    • Class A (5V), Class B (3V), and Class C (1.8V) supply voltage
    • Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol)
    • Serial peripheral interface (SPI), depending on packages
    • Industrial qualification (JEDEC JESD47)
    • -40°C to 105°C operating temperature
    • Common Criteria EAL5+
  • Security:
    • DES / 3DES / AES symmetric cryptography
    • Asymmetric cryptography RSA (up to 2048 bits)
    • HTTPS remote management TLS v1.0, v1.1 and v1.2
    • Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpool P256r1
    • MILENAGE, TUAK, and CAVE authentication algorithms

Applications

  • Cellular-connected nodes
  • Cat M1 and NBIoT LTE
  • Surveillance
  • IoT for smart homes and cities such as gas metering
  • IoT for smart industry such as tracking

Overview

SIM Plugin Package Types and Dimensions

STMicroelectronics ST4SIM-200M eSIM GSMA System-on-Chip (SoC)
Opublikowano: 2021-03-17 | Zaktualizowano: 2022-03-11