Molex SpeedStack Mezzanine Connector System
Molex SpeedStack Mezzanine Connector System offers a high-density, low-profile solution that delivers data rates up to 40Gbps per differential pair. With mated stack heights of 4mm to 10mm with a 0.80mm pitch, these connectors provide design flexibility for PCB space-constrained applications. The narrow housing design minimizes airflow obstructions and promotes system cooling. Molex SpeedStack Mezzanine Connector System utilizes a split-pad PCB design that allows for electrical tuning performance and provides edge card compatibility. The robust insert-molded wafer design with protected shrouded housing supports the terminal location to improve electrical balance within the signals for low-profile, high-density systems. In addition, a common grounding pin improves electrical performance and minimizes crosstalk.
Features
- Mated stack heights 4mm to 10mm with a 0.80mm pitch
- Multiple circuit sizes (22, 60, and 120) with a range of 6 to 32 differential pairs
- Split-pad PCB design
- 100Ω impedance design
- 85Ω impedance versions in development
- Robust insert-molded wafer design with protected shrouded housing
- Low-profile 0.80mm pitch and narrow housing design
- Shielding grounding pins
Applications
- Telecommunication
- Remote radio antennas
- Base stations
- Mobile
- Networking
- Servers
- Routers
- Switches
- Storage
- Military and medical
- Scanning equipment
- Consumer
- Camera
- Handheld scanners
Mezzanine Products Diagram
Related Connectors
Molex Board-to-Board Connectors
Variety of configurations for microminiature, high-speed, high-density, & high-power applications.
Molex SpeedMezz Connector Family
Offers high densities, low profiles, data rates up to 56Gbps per differential pair.
Opublikowano: 2013-03-21
| Zaktualizowano: 2025-03-26