Micron 8-High 24GB HBM3 Gen2 Memory

Micron 8-High 24GB HBM3 Gen2 Memory features bandwidth over 1.2TB/s and superior power efficiency enabled by advanced 1β (1-beta) process technology. This high-bandwidth memory (HBM) module is built for artificial intelligence (AI) and supercomputing, providing faster data rates, improved thermal response, and 50% higher monolithic die density within the same package footprint as the previous generation. The HBM3 solution is founded on Micron’s 1β DRAM process node, which allows a 24Gb DRAM die to be assembled into an 8-high cube within an industry-standard package dimension. Micron 8-High 24GB HBM3 Gen2 Memory addresses the increasing demands of generative AI for multimodal, multitrillion-parameter AI models.