Alif Semiconductor Balletto B1 DevKit & StartKit

Alif Semiconductor Balletto B1 DevKit and StartKit enable evaluation of the Balletto B1 MCUs. The B1 MCU features an Arm® Cortex® M-55 CPU core with Helium-M Vector Extension, operating at 160MHz. The MCU provides an Ethos-U55 neural network processor core with 128 MACs per cycle, 2MB of SRAM, and 1.8MB of NVM. Off-chip OSPI flash and PSRAM memory devices (64MB and 32MB, respectively) and a variety of digital/analog interfaces are included. The B1 MCU also offers a BLUETOOTH® LE 5.3 + 802.15.4 radio subsystem with a chip antenna.

The Balletto B1 DevKit (DK-B1) is a cost-effective, single-board platform that exposes all signals on the Balletto B1 MCU, making it easy to access power and performance profiling, prototyping, and more. The DK-B1 includes the BLE RF path and an antenna. Several pre-built applications are available on the DevKit platform to help users get started quickly.

The Balletto B1 StartKit (SK-B1) provides access to all pins for easy prototyping of user projects. Two microphones and a camera module are on board, plus one of hundreds of available mikroBUS™ click boards may be attached. SK-B1 includes the BLE RF path with an antenna.

Features

  • Bolletto family
    • Integrated hardware‑accelerated AI/ML
    • Arm Cortex M-55 CPU core with Helium-M Vector Extension
    • 160MHz operation
    • Ethos-U55 neural network processor core with 128 MACs per cycle
    • 2MB of SRAM
    • 1.8MB of NVM
    • Off-chip 64MB OSPI flash
    • 32MB PSRAM memory
    • Variety of digital/analog interfaces
    • BLE 5.3 + 802.15.4 radio subsystem with a chip antenna
  • Balletto B1 DevKit (DK-B1)
    • Single-board platform that exposes all signals on the Balletto B1 MCU
    • Easy to access power and performance profiling, prototyping, and more
    • Includes the BLE RF path and an antenna
    • Several pre-built applications available
  • Balletto B1 StartKit (SK-B1)
    • Provides access to all pins for easy prototyping
    • Two onboard microphones and a camera module
    • One of hundreds of available mikroBUS™ click boards may be attached
    • Includes the BLE RF path and an antenna

Applications

  • Wireless edge AI/endpoint AI
  • Wearables
  • Hearables and audio‑driven devices
  • Low‑power IoT devices
  • Smart home devices
  • Connected sensors with local intelligence
  • Rapid prototyping of wireless AI products
Opublikowano: 2026-04-28 | Zaktualizowano: 2026-05-11