Amphenol Commercial Millipacs® Plus Connectors
Amphenol Communications Millipacs® Plus Connectors are 2mm Hardmetric connectors with a choice of data rates ranging from 3 to 25Gb/s, with configurable and scalable high-speed, low-speed signal, guiding, and power modules. These connectors are available in vertical header on the backplane mating with right angle receptacle on a daughter card. The scalable design is easy to populate on boards and offers flexibility. Tulip contact systems and 2mm+ wiping distance ensure a high level of reliability with multiple contact points. Options for hot swapping, EMI shielding, and high temperature compatibility are available for Amphenol Communications Millipacs Plus Connectors.
Features
- Configurable modules
- Design flexibility and easy to pressfit
- Hardmetric equipment practice
- Popular backplane architecture with standard board-to-board distance
- Choice of contact mating levels
- Hot swapping of boards
- Choice of data rates
- Optimize cost
- Shielding Option
- EMI Protection
- Tulip contact design
- Multiple contact points ensuring high reliability
- Can withstand shock and vibration
Applications
- Automotive
- Communications
- Telecom
- Industrial
- Instrumentation
- Avionics
- Oil and gas-down the hole
- HVAC
- Renewable
- Embedded computing
- Heavy duty loaders
- Conveyers
- Factory automation
- Energy management system
- ESS
- Medical
Specifications
- Thermoplastic UL94 V0 insulation material
- 0.75N (max.) per contact pair mating force
- 0.15N (min.) per contact pair withdrawal force
- 200Kpsi (min.) Hertz stress
- Longitudinal ±2.0mm and Transversal ±2.5mm misalignment
- ±2.0° inclination
- 10N (max.) insertion force
- 1.6N (min.) withdrawal force
- Operating Current:
- 1.5A at 20°C
- 1A at 70°C
- 750Vrms test voltage
- 20mΩ (max.) contact resistance
- 10,000MΩ (min.) insulation resistance
- Up to 40A operating current
- <1mΩ under 10A contact resistance
Opublikowano: 2023-03-22
| Zaktualizowano: 2023-03-30