ADLINK Technology VPX3-TL SOSA-Aligned 3U VPX Processor Blades
ADLINK Technology VPX3-TL SOSA-Aligned 3U VPX Processor Blades are powered by Intel® Xeon® W-11000E series processor, formerly Tiger Lake-H, and deliver performance improvements for enhanced data/graphics and the AI acceleration capabilities required for next-generation mission-critical applications. The Sensor Open Systems Architecture (SOSA) aligned VPX3-TL module offers embedded computing capabilities that are easily reconfigurable and upgradable, highly cost-effective, and quick to develop and deploy.
The ADLINK VPX3-TL blades are SWaP-optimized and include up to 64GB DDR4-2666 soldered ECC SDRAM; 2x 10GBASE-KR or 2x 1GBASE-KX; one XMC expansion slot with PCIe x8 Gen3 to P2 rear I/O; USB 3.0 and SATA III (formerly known as SATA 6Gb/s), for high I/O throughput. Options include up to 1TB M.2 SSD for secondary storage. The Intel® RM590E chipset with Unified Extensible Firmware Interface (UEFI) secure boot, and dual 256Mbit SPI flash supports Microsoft Windows 10, Linux, and VxWorks 7.
Features
- Intel® Xeon® W-11000E series processor (formerly Tiger Lake-H), up to 8 cores with 45W TDP
- SOSA-aligned and VITA 46/47/48/65 compliant for quick deployment
- DDR4-2666 soldered ECC SDRAM, up to 64GB
- Up to 1TB M.2 SSD optional
- One XMC expansion slot with PCIe x8 Gen3
- Ethernet connectivity
- 1x 2.5GBASE-T to P2
- 2x 10GBASE-KR to P1
- 2x 1GBASE-KX to P1 (optional)
- 1x DisplayPort to P2, supports DP++ with resolution up to 8K/60Hz
- Supports VxWorks 7, Linux (kernel 5.4 and higher)
Specifications
- Connectivity
- XMC
- 1x PCIe x8 Gen3 to J15
- Rear I/O (X16s+X8d) to P2 and X12d to P1 from J16
- Supports +5V or +12V PWR by BOM option (default is +5V)
- Supports XMC 1.0 and 2.0 connector by BOM option
- Dataplane
- 1x PCIe x4 to P1 (Lane 0-3)
- 1x PCIe x8 to P1 (Lane 0-7)
- 1x PCIe x4 to P1 (Lane 4-7) expansion plane
- Control plane
- 2x 10GBASE-KR to P1 (default)
- 2x 1GBASE-KX to P1 (optional)
- Supports IOL/SOL
- Ethernet
- 1x 2.5GBASE-T to P2
- Supports PXE
- Supports Wake-On-LAN (WOL)
- Video
- 1x DisplayPort to P2
- Supports DP++
- Resolution up to 8K at 60Hz
- Display mode selection via BIOS
- USB
- 2x USB 2.0 to P2
- 1x USB 3.2 Gen1 to P2
- Supports USB 3.0 power to P1/G7 (supply 0.9A) with overcurrent protection
- Supports USB 2.0 power to P2/G9 (supply 0.5A) with overcurrent protection
- Serial ports
- COM2: RS-232/422/485 to P2 (RS-232 is 2-wire)
- 115200bps maximum data rate e for RS-232/422/485
- RS-485 supports auto flow control
- RS-232/422/485 mode configuration via BIOS
- Maintenance console port
- COM1: 2-wire TX/RX on P1
- Supports TIA-232 and LVCOMS (3.3V), mode configuration via BIOS
- PCIe
- 2x PCIe x4 co-layout with XMC x8d+X16s (on P2)
- PCIe NT function not supported
- GPIO
- 1x GPIO to P1, 3x GPIO to P2
- Supports +3.3V (default) or +5V GPIO by BOM option
- GPI with edge trigger or level trigger interrupt
- XMC
- Processor and system
- Intel® Xeon® W-11865MRE processor (formerly Tiger Lake-H), Up to 8 cores (TDP 45W)
- Intel® RM590E Chipset
- 32GB memory DDR4 soldered with ECC (up to 64GB)
- Dual 256Mbit SPI flash BIOS
- VITA 46/48/65 compliant and SOSA aligned
- MOD3-PAY-1F1F2U1TU1T1U1T-16.2.15-2 module profile
- SLT3-PAY-1F1F2U1TU1T1U1T- 14.2.16 slot profile
- Storage
- 1x SATA 6Gb/s to P2
- M.2
- 1x M.2 2242 on the top side (M-key)
- Supported M.2 devices: S1, S2, S3, D1, D2, D3, and D4
- M.2 capacity up to 1TB
- Security
- TPM
- Discrete TPM 2.0 chip
- Supports Intel Secure Boot (UEFI)
- Dual BIOS support
- TPM
- Operating systems
- Windows 10
- VxWorks 7
- Linux (kernel 5.4 and higher)
- Blade status LEDs on front and rear
- Reset Button on front panel, maskrest button reserved on RTM
- Conduction cooled 3U VPX form factor
- Temperature ranges
- Operating
- -40°C to +85°C at wedge locks with conduction cooling
- -40°C to +75°C with air cooling
- -50°C to +100°C storage
- Operating
- 95% relative humidity, non-condensing
Block Diagram
Opublikowano: 2021-08-25
| Zaktualizowano: 2024-04-03