ADLINK Technology COM-HPC-mPTL Mini Modules

ADLINK Technology COM-HPC-mPTL Mini Modules are compact, high-performance COM-HPC Mini computer-on-modules powered by Intel® Core™ Ultra Series 3 (Panther Lake) processors. The modules are designed to bring advanced edge artificial intelligence (AI) and graphics capabilities into space-constrained systems. The ADLINK COM-HPC-mPTL measures 95mm x 70mm and integrates up to 16 hybrid CPU cores, a next-generation Intel Arc™ GPU with up to 12 Xe3 cores, and an integrated Intel NPU 5.0 delivering up to 50TOPS of AI acceleration. With soldered LPDDR5x memory up to 64GB, the module delivers high bandwidth, low latency, and exceptional power efficiency, making it ideal for edge AI, intelligent vision, robotics, and real-time analytics applications that require deterministic performance in a small footprint.

Features

  • Intel Core Ultra Processor Series 3 with up to 16x cores (4P + 8E + 4LPE) at 15W to 65W TDP
  • Intel Arc Xe3 Graphics up to 120TOPS
  • Intel NPU 5.0 up to 50TOPS
  • 16x PCIe lanes (up to 12x PCIe Gen5 lanes)
  • Up to 64GB LPDDR5X memory, up to 8533MT/s
  • USB4, DP, HDMI, and eDP support

Applications

  • Edge AI
  • Intelligent vision
  • Robotics
  • Real-time analytics

Specifications

  • 95mm x 70mm mini-size module
  • PICMG COM-HPC R1.2 compliant
  • -40°C to +85°C industrial temperature support
  • 10-year product availability

Block Diagram

Block Diagram - ADLINK Technology COM-HPC-mPTL Mini Modules
Opublikowano: 2026-01-13 | Zaktualizowano: 2026-01-14