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JUMPtec COMe-mRP10 (E2) COM Express® Mini Type 10 Module

JUMPtec COMe-mRP10 (E2) COM Express® Mini Type 10 Module is based on 13th Gen Intel® Core™  (former codename Raptor Lake-P) and offers a significant performance increase compared to the previous generation. The JUMPtec COMe-mRP10 (E2) Module is equipped with up to 14 cores based on Intel performance hybrid architecture. The module provides essential, industrial-grade features such as support for in-band error correction code (IBECC) memory, Intel Time Coordinated Computing (Intel TCC), Time-Sensitive Networking (TSN), and an extended -40°C to +85°C operating temperature range. All features are perfect for applications in demanding areas such as industrial automation, health care, and automotive. 

Features

  • COM Express Mini Pin-out Type 10 compliance
  • 84mm x 55mm (HxW) size
  • Intel 13th Generation Core CPU
  • Integrated SoC
  • Dual-channel LPDDR5(x) memory down up to 32GByte
  • Graphics controller
    • Intel Iris® Xe Graphics on i7/i5 processors
    • Intel UHD Graphics on i3/Celeron® processors
  • Intel I226LM/I226IT Ethernet controller
  • Up to 2.5Gb Ethernet with TSN support
  • Two SATA 6Gb/s storage
  • Up to 1TByte NVMe SSD onboard Flash (on request)
  • Four PCIe 3.0
  • Display
    • DP++ DDI1
    • Single channel 18/24bit LVDS
  • Two USB 3.2 Gen2 (including USB 2.0) + six USB 2.0
  • Two serial interfaces (RX/TX only)
  • High-definition audio interface
  • (G) SPI, LPC, SMB, fast I2C, staged watchdog, and RTC
  • POSCAP capacitors
  • Trusted Platform Module (TPM) 2.0
  • ACPI 6.0 power management
  • Wide 4.75V to 20V single supply power range
  • AMI Aptio V BIOS
  • Windows®10, Linux, and VxWorks (project-based) operating systems
  • Operating temperature ranges
    • 0°C to +60°C commercial range
    • -40°C to +85°C industrial range
  • 93% relative humidity (RH) at +40°C, non-condensing (according to IEC 60068-2-78)

Applications

  • Industrial automation
  • Medical devices
  • Transportation and automotive
  • Retail and digital signage
  • Aerospace and defense
  • Internet of Things (IoT) and edge computing
  • Telecommunications

Block Diagram

Block Diagram - JUMPtec COMe-mRP10 (E2) COM Express® Mini Type 10 Module

Overview

Location Circuit - JUMPtec COMe-mRP10 (E2) COM Express® Mini Type 10 Module

Application Use Cases

Resources

Accessories

  • 34014-0000-99-0 Heatspreader for COM-mRP10, Cu-core, threaded mounting holes
  • 34014-0000-99-1 Heatspreader for COM-mRP10, Cu-core, through mounting holes
  • 34099-0000-99-0 COM Express mini universal active cooler for heatspreader mounting
  • 34099-0000-99-1 COM Express mini universal passive cooler for heatspreader mounting

Related Products

JUMPtec COMe Evaluation Carrier2 T10

Evaluation Carrier Board for COM Express® Mini COMs with full support for Type 10 feature set.

Learn Moreo JUMPtec COMe Evaluation Carrier2 T10 View Productspowiązany z JUMPtec COMe Evaluation Carrier2 T10
Opublikowano: 2025-01-20 | Zaktualizowano: 2025-10-29