-ar Multiprotocol Modules

Results: 239
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Description Datasheet Availability Pricing (PLN) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Series
Frequency
Output Power
Interface Type
Supply Voltage - Min
Supply Voltage - Max
Minimum Operating Temperature
Maximum Operating Temperature
Antenna Connector Type
Dimensions
Protocol - Bluetooth, BLE - 802.15.1
Protocol - Cellular, NBIoT, LTE
Protocol - GPS, GLONASS
Protocol - Sub GHz
Protocol - WiFi - 802.11
Protocol - ANT, Thread, Zigbee - 802.15.4
Product
Packaging
Silicon Labs Multiprotocol Modules Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 105 C, PCB trace antenna, certified.
Datasheet
Non-Stocked Lead-Time 20 Weeks
Min.: 1 000
Mult.: 1 000
: 1 000

2.4 GHz 12.5 dBm I2C, UART 1.8 V 3.8 V - 40 C + 105 C 22.5 mm x 15.5 mm x 2.25 mm Thread, Zigbee Reel
Silicon Labs Multiprotocol Modules Mighty Gecko ARM Cortex-M4 1024 kB flash, 256 kB RAM module
Datasheet
Non-Stocked Lead-Time 52 Weeks
Min.: 100
Mult.: 100

2.4 GHz I2C, SPI, UART 3.3 V 3.3 V - 40 C + 85 C 17.8 mm x 12.9 mm x 2.3 mm Wireless Mesh Modules Cut Tape
Silicon Labs Multiprotocol Modules Mighty Gecko ARM Cortex-M4 1024 kB flash, 256 kB RAM module
Datasheet
Non-Stocked Lead-Time 52 Weeks
Min.: 100
Mult.: 100

2.4 GHz I2C, SPI, UART 3.3 V 3.3 V - 40 C + 85 C 17.8 mm x 12.9 mm x 2.3 mm Wireless Mesh Modules Cut Tape
Silicon Labs Multiprotocol Modules Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, PCB trace antenna, certified.
Datasheet
Non-Stocked Lead-Time 20 Weeks
Min.: 100
Mult.: 100

2.4 GHz 12.5 dBm I2C, UART 1.8 V 3.8 V - 40 C + 125 C 22.5 mm x 15.5 mm x 2.25 mm Bluetooth Thread, Zigbee Multiprotocol Lighting Modules Cut Tape
Silicon Labs Multiprotocol Modules SiWG917Y SoC Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 2MB PSRAM in package
Datasheet
Non-Stocked Lead-Time 50 Weeks
Min.: 1
Mult.: 1
: 700

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Reel, Cut Tape
Telink Multiprotocol Modules Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Datasheet
Non-Stocked
Min.: 1
Mult.: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 35.29 mm x 18 mm x 2.6 mm Wireless Modules Reel
Silicon Labs MGM12P22F1024GE-V4R
Silicon Labs Multiprotocol Modules Mighty Gecko M4 Mod 1024 kBflash 256 kB
Datasheet
Non-Stocked Lead-Time 52 Weeks
Min.: 1 000
Mult.: 1 000
: 1 000

Reel
Silex Technology Multiprotocol Modules the option to attach an antenna via a trace does not include the u.Fl connector
Datasheet
Non-Stocked Lead-Time 34 Weeks
Min.: 1
Mult.: 1

260 MHz I2C, SPI, UART - 40 C + 85 C 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Multiprotocol Modules Cut Tape
Silex Technology Multiprotocol Modules IM-100 is a small, stand-alone, dual-band Wi-Fi 6 and Bluetooth Low Energy
Datasheet
Non-Stocked Lead-Time 34 Weeks
Min.: 1
Mult.: 1

260 MHz I2C, SPI, UART - 40 C + 85 C MHF 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Multiprotocol Modules Cut Tape
Silex Technology Multiprotocol Modules Based on NXP's RW610, IM-100 is a small, stand-alone, dual-band Wi-Fi 6
Datasheet
Non-Stocked Lead-Time 34 Weeks
Min.: 500
Mult.: 500
: 500

260 MHz I2C, SPI, UART - 40 C + 85 C MHF 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Multiprotocol Modules Reel
Silex Technology Multiprotocol Modules the option to attach an antenna via a trace. does not include the u.Fl connector
Datasheet
Non-Stocked Lead-Time 34 Weeks
Min.: 500
Mult.: 500
: 500

260 MHz I2C, SPI, UART - 40 C + 85 C 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Multiprotocol Modules Reel
Quectel Multiprotocol Modules Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1

2.4 GHz ADC, GPIO, I2C, PWM, UART 3 V 3.6 V - 40 C + 85 C 24 mm x 16 mm x 2.6 mm Bluetooth 5.2 802.11 b/g/n 802.11 b/g/n, Bluetooth 5.2
Quectel Multiprotocol Modules Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.3 V 3.5 V - 40 C + 85 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 4.2
Quectel Multiprotocol Modules Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.3 V 3.5 V - 40 C + 85 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 4.2
Quectel Multiprotocol Modules Wi-Fi /BT variant.2+16GB - Consumer temperature range. Do Not promote
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 3 000
Mult.: 200
: 200
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.5 V 3.5 V - 10 C + 75 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 4.2 Reel
Quectel Multiprotocol Modules Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.3 V 3.5 V - 40 C + 85 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 4.2
Quectel Multiprotocol Modules Embedded, 0-6000, Cable assembly, 150mm, -, SMA-female to IPEX MHFI
Datasheet
Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm ADC, GPIO, I2C, PCM, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C Built-In 18.7 mm x 16 mm x 2.1 mm EGPRS, LTE Cat-M1, LTE Cat NB2 GNSS EGPRS, GNSS, LTE CatM1, LTE Cat NB2
Quectel Multiprotocol Modules Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1

2.4 GHz ADC, GPIO, PWM, UART 3 V 3.6 V - 40 C + 85 C 17.91 mm x 14.99 mm x 2.8 mm Bluetooth 5.2 802.11 b/g/n 802.11 b/g/n, Bluetooth 5.2
Quectel Multiprotocol Modules Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1
850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm ADC, GPIO, I2C, PCM, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C 18.7 mm x 16 mm x 2.1 mm EGPRS, LTE Cat-M1, LTE Cat NB2 GNSS EGPRS, GNSS, LTE CatM1, LTE Cat NB2
Quectel Multiprotocol Modules Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1

2.4 GHz ADC, GPIO, PWM 3 V 3.6 V - 40 C + 105 C 17.3 mm x 15 mm x 2.8 mm Bluetooth 5.2 802.11 b/g/n 802.11 b/g/n, Bluetooth 5.2
Quectel Multiprotocol Modules Embedded, 2400-2500 MHz, Wi-Fi (Bluetooth), Ceramic, -, -, SMD, 3.2 1.6 0.5
Datasheet
Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1
850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 23 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm EGPRS, LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS BDS, EGPRS, Galileo, GLONASS, GPS, LTE Cat M1/NB2
Quectel Multiprotocol Modules
Datasheet
Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1
850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm EGPRS, LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS BDS, EGPRS, Galileo, GLONASS, GPS, LTE Cat M1/NB2
Quectel Multiprotocol Modules
Datasheet
Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1

21 dBm ADC, GPIO, I2C, PCM, USB 2.0, UART 2.6 V 4.8 V - 35 C + 75 C RP-SMA 14.9 mm x 12.9 mm x 1.7 mm LTE Cat-M1/NB2 GLONASS, GPS GLONASS, GPS, LTE Cat M1/NB1/NB2
Quectel Multiprotocol Modules
Datasheet
Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1

21 dBm ADC, GPIO, I2C, PCM, USB 2.0, UART 2.6 V 4.8 V - 35 C + 75 C RP-SMA 14.9 mm x 12.9 mm x 1.7 mm LTE Cat-M1/NB2 GNSS GNSS, LTE CatM1/NB2
Quectel Multiprotocol Modules Embedded, 2410-2490 MHz, 4920-5925 MHz,, Wi-Fi (Bluetooth), PFC with cable, 100 +/-2 mm, IPEX ?(U.FL Generation ?), Adhesive, 30x30x0.25
Datasheet
Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1
23 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS BDS, Galileo, GLONASS, GPS, LTE Cat M1/NB2