LBEE5WV2GF-001

Murata Electronics
81-LBEE5WV2GF-001
LBEE5WV2GF-001

Mfr.:

Description:
Multiprotocol Modules Type 2GF Shielded Small Wi-Fi 11a/b/g/n/ac Dual-band SISO + Bluetooth 5.4 Module

Datasheet:
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Learn more about Murata Electronics LBEE5WV2GF-001
Product available only to OEM/EMS and design business customers. Product is not shipped to consumers in the EU or the UK. This product will require additional documentation to export from the United States.

Product Attribute Attribute Value Select Attribute
Murata
Product Category: Multiprotocol Modules
Delivery Restrictions:
 Product available only to OEM/EMS and design business customers. Product is not shipped to consumers in the EU or the UK. This product will require additional documentation to export from the United States.
RoHS:  
2GF
2.412 GHz to 5.825 GHz
UART
3.2 V
4.6 V
- 20 C
+ 70 C
7 Channel
10 mm x 7.2 mm x 1.5 mm
Bluetooth 5.3
802.11 a/b/g/n/ac
Reel
Cut Tape
Brand: Murata Electronics
Features: MAC/BD Address Are Embedded
Moisture Sensitive: Yes
Mounting Style: SMD/SMT
Number of Channels: 1 Channel
Operating Supply Voltage: 3.2 V to 4.6 V
Product: Bluetooth
Product Type: Multiprotocol Modules
Shielding: Shielded
Factory Pack Quantity: 1000
Subcategory: Wireless & RF Modules
Type: WLAN Bluetooth Combo Module
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Attributes selected: 0

Datasheet

Models

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Compliance Codes
USHTS:
8473301180
ECCN:
5A992.C
Origin Classifications
Country of Origin:
China
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

Type 2GF W-LAN+BLUETOOTH® Combo Module

Murata Type 2GF W-LAN+BLUETOOTH® Combo Module is a compact, high-performance module based on the Infineon CYW43022 combo chipset. This module supports Wi-Fi® 802.11a/b/g/n/ac and Bluetooth 5.4 BR/EDR/LE, offering a PHY data rate of up to 78Mbps for Wi-Fi and 3Mbps for Bluetooth. The WLAN component is compatible with the SDIO v2.0 SDR25 interface, while the Bluetooth component features a high-speed 4-wire UART interface and PCM for audio-data transmission. The CYW43022 chipset incorporates advanced enhanced collaborative coexistence hardware mechanisms and algorithms designed to optimize the collaboration between WLAN and Bluetooth for maximum performance. This module is housed in a small-shielded form factor that facilitates integration into size- and power-sensitive applications such as IoT, gateways, and more.

In Stock: 95

Stock:
95 Can Dispatch Immediately
Factory Lead Time:
46 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- zł
Ext. Price:
-,-- zł
Est. Tariff:

Pricing (PLN)

Qty. Unit Price
Ext. Price
56,70 zł 56,70 zł
49,35 zł 493,50 zł
46,58 zł 1 164,50 zł
43,01 zł 4 301,00 zł
40,66 zł 10 165,00 zł
39,35 zł 19 675,00 zł
Full Reel (Order in multiples of 1000)
36,71 zł 36 710,00 zł
2 000 Quote

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