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Heat Sink Solutions

Würth Elektronik Heat Sink Solutions are designed to provide effective thermal management to improve performance, reduce system failure, and increase the lifespans of electronics. These high-performance heatsink solutions include WE-HIC and WE-HICI heatsinks for ICs, WE-HTO and WE-HTOI heatsinks for transistors, and WE-TMA accessories for mounting the heatsinks and transistors. The WE-HIC are standard heatsinks, while the WE-HICI are heatsinks with pre-applied thermal interface material. These heatsinks for ICs are available in unidirectional and bidirectional variants in four different sizes. The WE-HTO are standard heatsinks, while the WE-HTOI are heatsinks with pre-applied thermal interface material. These heatsinks for transistors are designed specifically for TO-220 and TO-247 packages. The transistor heatsinks are constructed from black-anodized aluminum and available in four types, including simple, curved, clip-on, and extruded. Applications include Ball Grid Array (BGA), Pin Grid Array (PGA), CPU, DC/DC converter, and microcontrollers.