LBEE5PA1LD-005

Murata Electronics
81-LBEE5PA1LD-005
LBEE5PA1LD-005

Mfr.:

Description:
Multiprotocol Modules Type 1LD Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 4.2

Lifecycle:
NRND:
Not recommended for new designs.
ECAD Model:
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More Information
Learn more about Murata Electronics LBEE5PA1LD-005
Product available only to OEM/EMS and design business customers. Product is not shipped to consumers in the EU or the UK. This product will require additional documentation to export from the United States.

Product Attribute Attribute Value Select Attribute
Murata
Product Category: Multiprotocol Modules
Delivery Alerts:
 Product available only to OEM/EMS and design business customers. Product is not shipped to consumers in the EU or the UK. This product will require additional documentation to export from the United States.
RoHS:  
1LD
2.4 GHz
17 dBm
GPIO, I2C, SPI, UART
1.8 V
3.6 V
- 40 C
+ 85 C
External
8.9 mm x 7.8 mm x 1.2 mm
Bluetooth 4.2
802.11 a/b/g/n/ac
AWS
Reel
Cut Tape
Brand: Murata Electronics
Data Rate: 11 Mb/s, 54 Mb/s, 65 Mb/s
Modulation Technique: CCK, DSSS, OFDM
Moisture Sensitive: Yes
Operating Supply Voltage: 3.3 V
Product Type: Multiprotocol Modules
Factory Pack Quantity: 1000
Subcategory: Wireless & RF Modules
Part # Aliases: LBEE5PA1LD-TEMP
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Attributes selected: 0

Compliance Codes
CNHTS:
8517629990
USHTS:
8517620090
ECCN:
5A992.C
Origin Classifications
Country of Origin:
China
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

Wireless Modules & Software

Murata Electronics Wireless Modules and Software provide solutions for wearable computing, intelligent homes, smart vehicles, digital health and fitness, machine-to-machine (M2M) commercial, and industrial applications. These complete solutions from Murata that combine sensors, wireless technology, and software to help build infrastructure for the Internet of Things (IoT). Through its wireless connectivity platforms, Murata continuously innovates how to connect and network devices, equipment, and processes to fully achieve IoT. Murata Electronics Wireless Modules and Software are available in a wide variety of connectivity solutions to meet the current and future needs of designers.

Type 1LD Ultra-Small Wi-Fi+BLUETOOTH+MCU Module

Murata Electronics Type 1LD Ultra-Small Wi-Fi®+BLUETOOTH®+MCU Module is based on the Infineon CYW43438 combo chipset and STMicroelectronics STM32F412 MCU. The board supports Wi-Fi 802.11b/g/n + Bluetooth 4.1 up to 96Mbps PHY data rates on Wi-Fi, and a 3Mbps PHY data rate on Bluetooth. The Type 1LD features an integrated 100MHz Arm® Cortex®-M4 MCU for host-side applications and offers an easy-to-design solution for data acquisition, device management, and industrial control applications. Wi-Fi-Bluetooth coexistence, SDIO high-speed bus design, RF matching, antenna design, and regulatory certification has been managed and tested. Each module offers a complete network controller solution. The Wi-Fi, TCP/IP, Bluetooth network stack, security supplicant, and other network application features are hosted directly on the module. Murata Type 1LD module is compact for integration into size- and power-sensitive applications.

Wi-Fi® Modules & Wi-Fi+BLUETOOTH® Modules

Murata Wi-Fi® Modules and Wi-Fi+BLUETOOTH® Modules allow users to connect to the internet directly, providing flexible wireless technology for IoT products. This wide portfolio of Wi-Fi modules supports IEEE 802.11a, 11b, 11g, and 11ac 2x2 MIMO standard, 2.4GHz and 5GHz band for wireless LAN, and Bluetooth 4.1/4.2/5.0/5.1 BR/EDR/LE communication. The interface for the host processor is SDIO or PCIe for high-throughput applications with radio-only modules and UART with MCU-embedded modules for lower data rate applications. The interface for Murata Bluetooth is UART.

Automotive Products for Infotainment

Murata Automotive Products for Infotainment are ideal for In-Vehicle Infotainment (IVI), navigation, and Electronic Throttle Control (ETC). Murata supplies high-reliability electronic components that take advantage of the characteristics of ceramics, such as thermal resistance and vibration resistance. The use of high-frequency technology cultivated by the 3G/4G communication market contributes to the expansion of the Car Navigation and IVI markets and the achievement of the M2M (telematics) system. 

In Stock: 845

Stock:
845 Can Dispatch Immediately
Factory Lead Time:
53 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- zł
Ext. Price:
-,-- zł
Est. Tariff:

Pricing (PLN)

Qty. Unit Price
Ext. Price
69,34 zł 69,34 zł
62,26 zł 622,60 zł
57,33 zł 1 433,25 zł
52,98 zł 5 298,00 zł
50,56 zł 12 640,00 zł
49,24 zł 24 620,00 zł
Full Reel (Order in multiples of 1000)
49,24 zł 49 240,00 zł

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