Moduły wieloprotokołowe

Wyniki: 1 608
Wybierz Obraz Nr części Produc. Opis Karta charakterystyki Dostępność Wycena (PLN) Filtruj wyniki w tabeli wg ceny jednostkowej zależnej od ilości. Il. RoHS Model ECAD Seria Częstotliwość Moc wyjściowa Rodzaj interfejsu Napięcie zasilania – min. Napięcie zasilania – max. Minimalna temperatura robocza Maksymalna temperatura robocza Rodzaj złącza antenowego Wymiary Protokół — Bluetooth, BLE — 802.15.1 Protokół — Sieć komórkowa, NBIoT, LTE Protokół — GPS, GLONASS Protokół — Sub-GHz Protokół — WiFi — 802.11 Protokół — ANT, Thread, Zigbee — 802.15.4 Kwalifikacje Opakowanie
Ezurio Multiprotocol Modules Module, BL54L15, Bluetooth LE, Chip Antenna, Tape and Reel
1 000Oczekiwane: 05.11.2026
Min.: 1
Wielokr.: 1
: 1 000
BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Reel, Cut Tape
Ezurio Multiprotocol Modules Module, Veda IF912, SIP, Dual Band, No Memory, RF Trace Pin, Cut Tape
220Oczekiwane: 21.09.2026
Min.: 1
Wielokr.: 1

IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Ezurio Multiprotocol Modules Module, Veda IF912, SIP, Dual Band, 8M PSRAM, 8M Flash, RF Trace Pin, Cut Tape
250Oczekiwane: 21.09.2026
Min.: 1
Wielokr.: 1

IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Ezurio Multiprotocol Modules Module, Veda IF913, SIP, Tri Band, No Memory, RF Trace Pin, Cut Tape
250Oczekiwane: 21.09.2026
Min.: 1
Wielokr.: 1
IF913 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Kaga FEI Multiprotocol Modules WLAN module for NXP IW611. WiFi 6 1x1 dual band, BT, BLE 5.4
300Oczekiwane: 26.11.2026
Min.: 1
Wielokr.: 1

SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Tray
Kaga FEI Multiprotocol Modules WLAN + ARM M33 MCU module for NXP RW612. WiFi 6 1x1 dual band, BT, BLE 5.4.
300Oczekiwane: 26.11.2026
Min.: 1
Wielokr.: 1

SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Tray
Insight SiP Multiprotocol Modules nRF52832 LoRa Transceiver & BLE 5 Module US
1 092Dostępna ilość z otwartych zamówień
Min.: 1
Wielokr.: 1
902 MHz to 928 MHz, 2.4 GHz 22 dBm SPI 1.8 V 3.6 V - 30 C + 85 C External 9.8 mm x 17.2 mm x 1.7 mm Bluetooth 5.0
GigaDevice Multiprotocol Modules RISC-V with BLE 5.2 and WiFi 6 certified module / 15 x 12.4 / 21 GPIO / -40-105 degC / onboard PCB antenna
800Oczekiwane: 20.11.2026
Min.: 1
Wielokr.: 1

RISC-V 2.412 GHz to 2.484 GHz 23.4 dBm UART 3 V 3.6 V - 40 C + 105 C 15 mm x 12.4 mm x 2.4 mm BLE WiFi
GigaDevice Multiprotocol Modules RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / external IPEX connection
800Oczekiwane: 01.01.2027
Min.: 1
Wielokr.: 1

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
GigaDevice Multiprotocol Modules RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / onboard PCB antenna
800Oczekiwane: 01.01.2027
Min.: 1
Wielokr.: 1

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
u-blox Multiprotocol Modules IW611, 802.11ax+BT, 2 antenna pins
1 000Oczekiwane: 17.08.2026
Min.: 1
Wielokr.: 1
: 500

MAYA-W2 18 dBm SPI - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox Multiprotocol Modules Host-based dual-band Wi-Fi 6 and Bluetooth LE module for IoT, 1 antenna pin
500Oczekiwane: 31.12.2026
Min.: 1
Wielokr.: 1
: 500

MAYA-W4 2.4 GHz, 5 GHz 15 dBm, 18 dBm SPI, UART, USB 3.13 VDC 3.46 VDC - 40 C + 85 C Pin 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
Microchip Technology Multiprotocol Modules Wi-Fi + Bluetooth LE Module, Chip Antenna
500Oczekiwane: 10.08.2026
Min.: 1
Wielokr.: 1
: 500

2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Reel, Cut Tape
Silicon Labs Multiprotocol Modules 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
1 070Oczekiwane: 04.09.2026
Min.: 1
Wielokr.: 1

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Cut Tape

Silicon Labs Multiprotocol Modules Wireless bluetooth SiP module, Secure Boot with Root of Trust and Secure Loader(RTSL), 78 MHz, 10 dBm
1 300Oczekiwane: 05.08.2026
Min.: 1
Wielokr.: 1

xGM240S 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C Built-In, RF 7 mm x 7 mm x 1.18 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Tray
Silicon Labs Multiprotocol Modules SiWG917Y SoC Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 2MB PSRAM in package
550Dostępna ilość z otwartych zamówień
Min.: 1
Wielokr.: 1

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Cut Tape
Telit Cinterion Multiprotocol Modules
387Oczekiwane: 10.08.2026
Min.: 1
Wielokr.: 1

1.4 MHz 23 dBm I2C, SPI, UART 2.2 V 4.5 V - 40 C + 85 C 18 mm x 15 mm NBIoT, LTE GPS, GLONASS Tray
Embedded Artists Multiprotocol Modules 2GF M.2 Module
45Oczekiwane: 30.10.2026
Min.: 1
Wielokr.: 1

2.4 GHz to 5 GHz 4-Wire UART, SDIO 3.15 V 3.46 V - 20 C + 70 C u.FL 802.11 a/b/g/n/ac Bulk
Insight SiP Multiprotocol Modules nRF52832 LoRa Transceiver & BLE 5 Module AS
100Dostępna ilość z otwartych zamówień
Min.: 1
Wielokr.: 1
920 MHz to 923 MHz, 2.4 GHz 14 dBm SPI 1.8 V 3.6 V - 30 C + 85 C External 9.8 mm x 17.2 mm x 1.7 mm Bluetooth 5.0
Intel Multiprotocol Modules Intel Wi-Fi 6 AX201 (Gig+), 2230, 2x2 AX+BT, No vPro
100Oczekiwane: 03.08.2026
Min.: 1
Wielokr.: 1

AX201 2.4 GHz, 5 GHz Bluetooth, M.2, WiFi 0 C + 80 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.2 802.11 ax
NXP Semiconductors Multiprotocol Modules IW610BHN/A1ZDI
25Oczekiwane: 29.10.2026
Min.: 1
Wielokr.: 1

IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Tray
NXP Semiconductors Multiprotocol Modules IW610CHN/A1ZDI
25Oczekiwane: 29.10.2026
Min.: 1
Wielokr.: 1

IW610CHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Tray
NXP Semiconductors Multiprotocol Modules IW610CUK/A1ZDI
25Oczekiwane: 29.07.2026
Min.: 1
Wielokr.: 1
: 2 000

IW610CUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel, Cut Tape
NXP Semiconductors Multiprotocol Modules IW610FHN/A1ZDI
25Oczekiwane: 29.10.2026
Min.: 1
Wielokr.: 1
: 2 700

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
NXP Semiconductors Multiprotocol Modules IW610FUK/A1ZDI
25Oczekiwane: 29.07.2026
Min.: 1
Wielokr.: 1
: 2 000

IW610FUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape