3.3 V Mobile Modules

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Description Datasheet Availability Pricing (PLN) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Series
Frequency
Output Power
Interface Type
Supply Voltage - Min
Supply Voltage - Max
Supply Current Transmitting
Supply Current Receiving
Minimum Operating Temperature
Maximum Operating Temperature
Antenna Connector Type
Dimensions
Protocol - Cellular, NBIoT, LTE
Packaging
Quectel Mobile Modules Cat 4 + 3G + 2G, 2Gbit ROM+2Gbit RAM, voice + data, Global
Datasheet
988On Order
Min.: 1
Mult.: 1
: 250

33 dBm I2C, UART, USB 3.3 V 3.3 V - 35 C + 75 C 32 mm x 29 mm x 2.4 mm Reel, Cut Tape
Quectel Mobile Modules LTE Cat 1bis, 4M, LTE only, No GNSS, No Quecopen, No VoLTE
Datasheet
492Expected 8/20/2026
Min.: 1
Mult.: 1
: 500

ADC, I2C, PCM, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C 17.7 mm x 15.8 mm x 2.4 mm LTE Cat 1 Reel, Cut Tape
u-blox Mobile Modules LTE/HSPA+/GSM module for Softbank (JP) Cat 4, B1, B3, B5, B7, B8 PCIe card, 51x30 mm, MOQ 160pcs, on tray
Datasheet
Non-Stocked
Min.: 160
Mult.: 160

1.9 GHz 23 dBm GPIO, I2C, UART, USB 3.3 V 3.3 V 880 mA 880 mA - 20 C + 65 C 51 mm x 30 mm x 3.7 mm 2G/3G, LTE
u-blox Mobile Modules LTE Cat 4 only; Japan/NTT docomo LTE: 1,3,5,8,19 PCIe card, 51x30 mm, MOQ 160pcs, on tray
Datasheet
Non-Stocked
Min.: 160
Mult.: 160

2.1 GHz 23 dBm GPIO, I2C, UART, USB 3.3 V 3.3 V 880 mA 880 mA - 20 C + 65 C 51 mm x 30 mm x 3.7 mm 2G/3G, LTE
u-blox Mobile Modules LTE/HSPA+/GSM module LTE:B1,B3,B5,B7,B8,B28; 3G :B1,B2,B5,B8 PCIe card, 51x30 mm, MOQ 160pcs, on tray
Datasheet
Non-Stocked
Min.: 160
Mult.: 160

2.1 GHz 23 dBm GPIO, I2C, UART, USB 3.3 V 3.3 V 880 mA 880 mA - 20 C + 65 C 51 mm x 30 mm x 3.7 mm 2G/3G, LTE
u-blox Mobile Modules LTE-M and NB-IoT global module UBX-R5 Cat M1/NB2 LGA, 16x26 mm, 250 pcs/reel
Datasheet
Non-Stocked Lead-Time 26 Weeks
Min.: 250
Mult.: 250
: 250

SARA-R520 250 mHz to 10 MHz I2C, SDIO, SPI, UART, USB 3.3 V 4.5 V - 20 C + 85 C Cellular, NBIoT, LTE Reel
Quectel Mobile Modules 5G mmWave + Sub-6G, Rel-17, NSA/SA operation, up to 1000Mhz bandwidth
Non-Stocked Lead-Time 12 Weeks
Min.: 100
Mult.: 100
: 100
ADC, GPIO, I2C, PCIe, PCM, SPI, UART, USB 2.0, USB 3.0, USB 3.1 3.3 V 4.4 V - 30 C + 70 C 53 mm x 46 mm x 3.05 mm Reel
Quectel Mobile Modules Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1
3.3 V 4.3 V - 35 C + 75 C 23.6 mm x 19.9 mm x 2.4 mm LTE Cat 1
Quectel Mobile Modules Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1
ADC, I2C, PCM, SPI, UART, USB 2.0 3.3 V 4.3 V 26.5 mm x 22.5 mm x 2.4 mm LTE Cat 1
Quectel Mobile Modules Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1
ADC, I2C, PCM, SPI, UART, USB 2.0 3.3 V 4.3 V 26.5 mm x 22.5 mm x 2.4 mm LTE Cat 1
Quectel Mobile Modules IoT/M2M-optimized LTE Cat 1 Modules
Datasheet
Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1

UART, USB, PCM, I2C, Netlight, SPI 3.3 V 4.3 V - 35 C + 75 C LTE, Cat-M1
Quectel Mobile Modules External, 600-6000, 5G, Dipole, -, SMA Male (center pin) , Terminal, 221 26.95 13.5
Datasheet
Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V 22 mA - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1
Quectel Mobile Modules External, 690-960, 1710-2690 , LTE (4G), Monopole, 1500 +/-30, SMA Male (center pin) , Magnetic, 112 29.8
Datasheet
Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V 18 mA - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1
Quectel Mobile Modules External, 700-2700, 3300-5000 , 5G, Dipole, 1500, SMA Male (center pin) , Magnetic, 234 F 60, 1.5 DS
Datasheet
Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1
Quectel Mobile Modules
Datasheet
Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1

ADC, I2C, PCM, SPI, UART, USB 2.0 3.3 V 4.3 V 31 mA - 35 C + 75 C 29 mm x 25 mm x 2.3 mm LTE Cat 4
Quectel Mobile Modules Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1
3.3 V 4.3 V - 35 C + 75 C 23.6 mm x 19.9 mm x 2.4 mm LTE Cat 1
Quectel Mobile Modules
Datasheet
Non-Stocked Lead-Time 10 Weeks
Min.: 250
Mult.: 250
: 250
ADC, I2C, LCM, SPI, USB 2.0, UART 3.3 V 4.3 V - 35 C + 75 C 23.6 mm x 19.9 mm x 2.4 mm Cellular, IoT, LTE Reel
Quectel Mobile Modules GSM/GPRS, Quad-band, LCC form factor
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 250
Mult.: 250
: 250

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 2 W Audio, PCM, UART 3.3 V 4.6 V - 40 C + 85 C Pad 23.6 mm x 19.9 mm x 2.65 mm GSM/GPRS Reel
Quectel Mobile Modules Cat 1 + 3G + 2G, mPCIe form factor
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 100
Mult.: 100
: 100

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V 34 mA 34 mA - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel
Quectel Mobile Modules LTE Cat 1bis + 2G, global, VoLTE, w/o GNSS, w/o BT
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1
Mult.: 1
: 250

ADC, GPIO, I2C, PCM, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C 29 mm x 25 mm x 2.4 mm LTE Cat 1 Reel, Cut Tape
Quectel Mobile Modules Cat 1bis + 2G, 8M, w/o GNSS, w/o BT4.2, EMEA/ Australia/ New Zealand
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1
Mult.: 1
: 250

ADC, Audio, I2C, SPI, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C Built-in 31 mm x 28 mm x 2.4 mm LTE Cat 1 Reel, Cut Tape
Quectel Mobile Modules Cat 1 + 3G + 2G module
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 250
Mult.: 250
: 250

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel
Quectel Mobile Modules CAT 1
Datasheet
Non-Stocked
Min.: 250
Mult.: 250
: 250

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel
Quectel Mobile Modules Cat 1 + 3G + 2G, 1Gbit ROM+1Gbit RAM, Latin A, Australia, NZ
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 250
Mult.: 250
: 250

EC/EG21 33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel
Quectel Mobile Modules
Datasheet
Non-Stocked
Min.: 250
Mult.: 1

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V 17 mA - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1