SEARAY™ SEAF & SEAM Connectors

Samtec SEARAY™ SEAF and SEAM Connectors feature a 1.27mm pitch grid, a rugged Edge Rate®contact system, and up to 56Gbps high-speed performance. SEAF high-density socket connectors series includes the SEAF-RA right-angle socket, the SEAF8 0.8mm open-pin-field array, the SEAFP press-fit socket, and the SEAFP-RA right-angle press-fit socket. The SEAM connectors feature low insertion/withdrawal forces and are available in 7mm to 17.5mm stack heights. Samtec SEARAY SEAF and SEAM Connectors meet IPC-A-610F and IPC J-STD-001F standards.

Wyniki: 773
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Opis Karta charakterystyki Dostępność Wycena (PLN) Filtruj wyniki w tabeli wg ceny jednostkowej zależnej od ilości.
Il. RoHS Model ECAD Produkt
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Wysokość stosu
Prąd znamionowy
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Minimalna temperatura robocza
Maksymalna temperatura robocza
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Seria
Opakowanie
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
524Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 375

Sockets 240 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
165Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 225

Sockets 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
147Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 325

Sockets 240 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
78Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 225

Sockets 320 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
384Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 225

Sockets 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
205Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 200

Sockets 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 1.27MM SEARAY HS HD ARRAY SKT
Karta charakterystyki
154Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 325

Sockets 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
158Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 200

Connectors 240 Position 1.27 mm (0.05 in) 6 Row Solder Straight 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
152Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 125

Sockets 300 Position 1.27 mm (0.05 in) 6 Row Solder Right Angle 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
43Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 75

Sockets 400 Position 1.27 mm (0.05 in) 8 Row Solder Right Angle 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
77Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 50

Sockets 500 Position 1.27 mm (0.05 in) 10 Row Solder Right Angle 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
101Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 275

Sockets 500 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
167Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 375

Headers 300 Position 1.27 mm (0.05 in) 6 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
99Na stanie magazynowym
275Oczekiwane: 30.03.2026
Min.: 1
Wielokr.: 1
Szpula: 275

Sockets 500 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
102Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 225

Sockets 500 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
307Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 200

Sockets 500 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
100Na stanie magazynowym
200Oczekiwane: 18.03.2026
Min.: 1
Wielokr.: 1
Szpula: 200

Sockets 400 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
265Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 200

Sockets 500 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
108Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 100

Connectors 160 Position 0.8 mm (0.031 in) 8 Row Solder Right Angle 1.3 A 220 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF8-RA Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
85Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 100

Connectors 240 Position 0.8 mm (0.031 in) 8 Row Solder Right Angle 1.3 A 220 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF8-RA Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
100Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 100

Connectors 320 Position 0.8 mm (0.031 in) 8 Row Solder Right Angle 1.3 A 220 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF8-RA Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
167Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 225

Headers 120 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
903Na stanie magazynowym
Dostępność opcji MouseReel
Min.: 1
Wielokr.: 1
Szpula: 225

Headers 120 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape, MouseReel
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
294Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 200

Headers 160 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 11 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
130Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 150

Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 12 mm, 13 mm, 13.5 mm, 14.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape