5G Automotive & Transportation Solutions

Samtec 5G Automotive and Transportation Connectivity meets the needs of the growing 5G network market. As implementation of the 5G network quickly gains momentum, high-performance devices, systems, and test and measurement equipment are needed to support the ultra-high frequencies and high data rates that technologies like mmWave, Massive MIMO, beamforming, and full duplex demand. Samtec offers high-performance interconnects and high-level technical expertise to support these requirements, including an expanding portfolio of solutions ideal for Automotive applications.

Wyniki: 4 277
Wybierz Obraz Nr części
 Produc.
Opis Karta charakterystyki Dostępność Wycena (PLN) Filtruj wyniki w tabeli wg ceny jednostkowej zależnej od ilości.
Il. RoHS Model ECAD Produkt
Liczba pozycji
Skok
Liczba rzędów
Styl styku
Kąt montażu
Wysokość stosu
Prąd znamionowy
Napięcie znamionowe
Maksymalna szybkość transmisji danych
Minimalna temperatura robocza
Maksymalna temperatura robocza
Pokrycie styku
Materiał styku
Materiał oprawy
Seria
Opakowanie
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
88Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 150

Connectors 180 Position 1.27 mm (0.05 in) 6 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
35Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 75

Connectors 300 Position 1.27 mm (0.05 in) 10 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
29Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 100

Connectors 180 Position 1.27 mm (0.05 in) 6 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
134Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 300

Connectors 160 Position 1.27 mm (0.05 in) 4 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
274Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 300

Connectors 200 Position 1.27 mm (0.05 in) 4 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
48Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 150

Connectors 300 Position 1.27 mm (0.05 in) 6 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
2Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 100

Sockets 160 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
68Na stanie magazynowym
100Oczekiwane: 17.02.2026
Min.: 1
Wielokr.: 1
Szpula: 100

Headers 160 Position 1.27 mm (0.05 in) 8 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
45Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 75

Headers 200 Position 1.27 mm (0.05 in) 10 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
94Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 100

Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050" SEARAY High-Speed High-Density Open-Pin-Field Array Socket, 40 Pos, 4 Row
Karta charakterystyki
325Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 325

Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
128Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 125

Connectors 160 Position 1.27 mm (0.05 in) 4 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
70Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 125

Connectors 240 Position 1.27 mm (0.05 in) 8 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
86Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 125

Connectors 180 Position 1.27 mm (0.05 in) 6 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
89Na stanie magazynowym
125Oczekiwane: 23.02.2026
Min.: 1
Wielokr.: 1
Szpula: 125

Connectors 160 Position 1.27 mm (0.05 in) 4 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
174Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 175

Connectors 400 Position 1.27 mm (0.05 in) 8 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.80 mm Q Strip High-Speed Ground Plane Socket Strip
Karta charakterystyki
70Na stanie magazynowym
Min.: 1
Wielokr.: 1

Receptacles 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 2 A, 23 A 225 V - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSE Tray
Samtec Board to Board & Mezzanine Connectors 0.80 mm Q Strip High-Speed Ground Plane Socket Strip
Karta charakterystyki
85Na stanie magazynowym
Min.: 1
Wielokr.: 1

Sockets 28 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 5 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSE Tray
Samtec Board to Board & Mezzanine Connectors 0.80 mm Q Strip High-Speed Ground Plane Socket Strip
Karta charakterystyki
22Na stanie magazynowym
Min.: 1
Wielokr.: 1

Sockets 28 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 5 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSE Tray
Samtec Board to Board & Mezzanine Connectors 0.80 mm Q Strip High-Speed Ground Plane Socket Strip
Karta charakterystyki
39Na stanie magazynowym
Min.: 1
Wielokr.: 1

Sockets 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 5 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSE Tray
Samtec Board to Board & Mezzanine Connectors 0.80 mm Q Strip High-Speed Ground Plane Socket Strip
Karta charakterystyki
220Na stanie magazynowym
Min.: 1
Wielokr.: 1

Connectors 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 5 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSE Tray
Samtec Board to Board & Mezzanine Connectors 0.80 mm Q Strip High-Speed Ground Plane Socket Strip
Karta charakterystyki
45Na stanie magazynowym
Min.: 1
Wielokr.: 1

Sockets 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 5 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSE Tray
Samtec Board to Board & Mezzanine Connectors 0.80 mm Q Strip High-Speed Ground Plane Socket Strip
Karta charakterystyki
40Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 475

Sockets 28 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 5 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSE Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.80 mm Q Strip High-Speed Ground Plane Socket Strip
Karta charakterystyki
104Na stanie magazynowym
Min.: 1
Wielokr.: 1

Sockets 40 Position 0.8 mm (0.031 in) 2 Row Solder Straight 5 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSE Tray
Samtec Board to Board & Mezzanine Connectors 0.80 mm Q Strip High-Speed Ground Plane Socket Strip
Karta charakterystyki
195Na stanie magazynowym
Min.: 1
Wielokr.: 1

Sockets 40 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 5 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSE Tray