114110207

Seeed Studio
713-114110207
114110207

Produc.:

Opis:
Single Board Computers Jetson AGX Orin 32GB H01 Kit with Jetson AGX Orin 32GB Module, 200 TOPs, Wi-Fi, Bluetooth, Aluminum case with cooling fan, Pre-installed JetPack System

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Seeed Studio
Kategoria produktów: Komputery jednopłytowe
Ograniczenia dotyczące wysyłki
 Firma Mouser aktualnie nie sprzedaje tego produktu w Twoim regionie.
RoHS:  
NVIDIA
Jetson AGX Orin
ARM Cortex A78AE
9 V to 20 V
- 25 C
+ 70 C
107 mm x 106.4 mm x 70.5 mm
Marka: Seeed Studio
Liczba rdzeni: 8 Core
Rozmiar pamięci wbudowanej: 64 GB
Typ pamięci wbudowanej: eMMC
Rodzaj produktu: Single Board Computers
Podkategoria: Computing
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Wybrane atrybuty: 0

TARIC:
8471500000
CAHTS:
8471500090
USHTS:
8471500150
JPHTS:
847150000
MXHTS:
8471500100
ECCN:
5A992.C

Nvidia® Next-Gen Jetson Orin™ Modules

Seeed Studio Nvidia® Next-Gen Jetson Orin™ Modules are powered by the same AI software and cloud-native workflows used across other NVIDIA platforms. At different performance levels, these modules deliver the power efficiency and accelerated computing capabilities needed to build autonomous machines at the edge. The powerful Jetson Software stack also allows users to bring products to market faster. Three series are available: the Jetson AGX Orin, Jetson Orin NX, and Jetson Orin Nano.

Jetson AGX Orin 32GB H01 Module Kit

Seeed Studio Jetson AGX Orin 32GB H01 Module Kit is a powerful solution for AI development, featuring the high-performance Jetson AGX Orin™ 32GB Module. The Seeed Studio kit has a comprehensive carrier board with advanced connectivity options. With 200 TOPs of AI processing power and pre-installed JetPack 5.0.2, this kit provides an alternative to the Jetson AGX Orin Dev Kit. The kit comes with a heatsink and cooling fan, an aluminum case, and an array of ports. The ports include PCIe X16, GbE, 10GbE, USB 3.2, HDMI 2.1, M.2 Key M and E, Wi-Fi®, BLUETOOTH®, MIPI CSI-2, and a 40-pin header.

NVIDIA® Jetson AGX Orin™ Modules

Seeed Studio NVIDIA® Jetson AGX Orin™ Modules provide up to 275 TOPS and 8X the performance (than the last generation) for multiple concurrent AI inference pipelines and high-speed interface support for multiple sensors. Available in 64GB and 32GB versions, the modules offer power configurable from 15W to 60W in the same compact form factor. These modules are ideal for energy-efficient autonomous machines from manufacturing and logistics to retail and healthcare.