High-Density Arrays

Samtec High-Density Arrays include board-to-board mezzanine connectors and rectangular cable assemblies. These components are offered in a range of mounting angles, including horizontal, right, straight, and vertical with a wide selection of termination styles. The number of positions ranges from 100 to 560 while the number of rows ranges from 4 to 14. Samtec High-Density Arrays are available in several pitches, including 0.635mm, 0.8mm, and 1.27mm.

Wyniki: 2 051
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 Produc.
Opis Karta charakterystyki Dostępność Wycena (PLN) Filtruj wyniki w tabeli wg ceny jednostkowej zależnej od ilości.
Il. RoHS Model ECAD Produkt
Liczba pozycji
Skok
Liczba rzędów
Styl styku
Kąt montażu
Wysokość stosu
Prąd znamionowy
Napięcie znamionowe
Maksymalna szybkość transmisji danych
Minimalna temperatura robocza
Maksymalna temperatura robocza
Pokrycie styku
Materiał styku
Materiał oprawy
Seria
Opakowanie
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
143Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 75

Headers 500 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 16 mm, 17 mm, 17.5 mm, 18.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
200Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 100

Headers 400 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 16 mm, 17 mm, 17.5 mm, 18.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
50Na stanie magazynowym
150Oczekiwane: 17.02.2026
Min.: 1
Wielokr.: 1
Szpula: 75

Headers 500 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 16 mm, 17 mm, 17.5 mm, 18.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
183Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 325

Plugs 40 Position 0.8 mm (0.031 in) 4 Row Solder Straight 1.3 A 220 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
615Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 650

Plugs 40 Position 0.8 mm (0.031 in) 4 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
330Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 325

Plugs 40 Position 0.8 mm (0.031 in) 4 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
160Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 225

Plugs 100 Position 0.8 mm (0.031 in) 10 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
322Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 375

Plugs 160 Position 0.8 mm (0.031 in) 8 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
360Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 475

Plugs 80 Position 0.8 mm (0.031 in) 4 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
152Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 375

Plugs 160 Position 0.8 mm (0.031 in) 8 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
680Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 275

Plugs 80 Position 0.8 mm (0.031 in) 4 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
340Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 350

Plugs 240 Position 0.8 mm (0.031 in) 6 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
243Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 250

Plugs 160 Position 0.8 mm (0.031 in) 4 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
198Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 250

Plugs 160 Position 0.8 mm (0.031 in) 4 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
180Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 175

Plugs 320 Position 0.8 mm (0.031 in) 8 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
157Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 175

Plugs 400 Position 0.8 mm (0.031 in) 10 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
88Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 225

Plugs 500 Position 0.8 mm (0.031 in) 10 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
421Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 475

Plugs 200 Position 0.8 mm (0.031 in) 4 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
94Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 375

Plugs 300 Position 0.8 mm (0.031 in) 6 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
91Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 350

Plugs 400 Position 0.8 mm (0.031 in) 8 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
240Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 275

Plugs 200 Position 0.8 mm (0.031 in) 4 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
311Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 275

Plugs 300 Position 0.8 mm (0.031 in) 6 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
127Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 175

Plugs 500 Position 0.8 mm (0.031 in) 10 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
462Na stanie magazynowym
Dostępność opcji MouseReel
Min.: 1
Wielokr.: 1
Szpula: 475

Plugs 60 Position 0.8 mm (0.031 in) 6 Row Solder Vertical 1.3 A 220 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape, MouseReel
Samtec Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
100Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 275

Plugs 180 Position 0.8 mm (0.031 in) 6 Row Solder Vertical 1.3 A 220 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape