High-Density Arrays

Samtec High-Density Arrays include board-to-board mezzanine connectors and rectangular cable assemblies. These components are offered in a range of mounting angles, including horizontal, right, straight, and vertical with a wide selection of termination styles. The number of positions ranges from 100 to 560 while the number of rows ranges from 4 to 14. Samtec High-Density Arrays are available in several pitches, including 0.635mm, 0.8mm, and 1.27mm.

Wyniki: 2 051
Wybierz Obraz Nr części
 Produc.
Opis Karta charakterystyki Dostępność Wycena (PLN) Filtruj wyniki w tabeli wg ceny jednostkowej zależnej od ilości.
Il. RoHS Model ECAD Produkt
Liczba pozycji
Skok
Liczba rzędów
Styl styku
Kąt montażu
Wysokość stosu
Prąd znamionowy
Napięcie znamionowe
Maksymalna szybkość transmisji danych
Minimalna temperatura robocza
Maksymalna temperatura robocza
Pokrycie styku
Materiał styku
Materiał oprawy
Seria
Opakowanie
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
99Na stanie magazynowym
275Oczekiwane: 30.03.2026
Min.: 1
Wielokr.: 1
Szpula: 275

Sockets 500 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
102Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 225

Sockets 500 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
149Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 325

Sockets 300 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
307Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 200

Sockets 500 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
100Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 200

Sockets 400 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
265Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 200

Sockets 500 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
115Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 100

Connectors 160 Position 0.8 mm (0.031 in) 8 Row Solder Right Angle 1.3 A 220 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF8-RA Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Karta charakterystyki
85Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 100

Connectors 240 Position 0.8 mm (0.031 in) 8 Row Solder Right Angle 1.3 A 220 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF8-RA Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
131Na stanie magazynowym
Dostępność opcji MouseReel
Min.: 1
Wielokr.: 1
Szpula: 75

Headers 160 Position 1.27 mm (0.05 in) 8 Row Solder Right Angle 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM-RA Reel, Cut Tape, MouseReel
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
224Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 375

Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
1 003Na stanie magazynowym
Dostępność opcji MouseReel
Min.: 1
Wielokr.: 1
Szpula: 225

Headers 120 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape, MouseReel
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
130Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 225

Headers 200 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
431Na stanie magazynowym
Dostępność opcji MouseReel
Min.: 1
Wielokr.: 1
Szpula: 325

Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape, MouseReel
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
394Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 200

Headers 160 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 11 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 1.27MM SEARAY HS HD OPEN TERM
Karta charakterystyki
147Na stanie magazynowym
Dostępność opcji MouseReel
Min.: 1
Wielokr.: 1
Szpula: 200

Headers 120 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 11 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape, MouseReel
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
294Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 200

Headers 160 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 11 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
130Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 150

Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 12 mm, 13 mm, 13.5 mm, 14.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
102Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 100

Headers 120 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 16 mm, 17 mm, 17.5 mm, 18.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
111Na stanie magazynowym
Dostępność opcji MouseReel
Min.: 1
Wielokr.: 1
Szpula: 100

Headers 160 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 16 mm, 17 mm, 17.5 mm, 18.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape, MouseReel
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
305Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 375

Headers 120 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
185Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 225

Headers 240 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
196Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 225

Headers 180 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
255Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 225

Headers 240 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
396Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 125

Headers 120 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 12 mm, 13 mm, 13.5 mm, 14.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Karta charakterystyki
108Na stanie magazynowym
Min.: 1
Wielokr.: 1
Szpula: 125

Headers 120 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 12 mm, 13 mm, 13.5 mm, 14.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape