565-290-721P60

EDAC
587-565-290-721P60
565-290-721P60

Produc.:

Opis:
Pin & Socket Connectors E-SEAL Waterproof Connector Crimp Contact

Karta charakterystyki:
Model ECAD:
Pobierz bezpłatną aplikację Library Loader, aby skonwertować ten plik do narzędzia ECAD Tool. Dowiedz się więcej o modelu ECAD.
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Dowiedz się więcej o EDAC 565-290-721P60

Na stanie magazynowym: 151

Stany magazynowe:
151 Wysylamy natychmiast
Minimum: 1   Wielokrotności: 1
Cena jednostkowa:
-,-- zł
wewn. Cena:
-,-- zł
Szac. taryfa:

Cennik (PLN)

Il. Cena jednostkowa
wewn. Cena
20,73 zł 20,73 zł
18,62 zł 186,20 zł
16,25 zł 406,25 zł
16,04 zł 1 539,84 zł
14,49 zł 4 173,12 zł
11,57 zł 6 664,32 zł
10,97 zł 11 584,32 zł
10,49 zł 27 190,08 zł
5 088 Oferta

Alternatywne pakowanie

Produc. Nr części:
565-290-721
Opakowanie:
Dostępność:
Na stanie magazynowym
Cena:
0,44 zł
Min.:
1

Atrybuty produktu Wartość atrybutu Wybierz atrybut
EDAC
Kategoria produktów: Złącza stykowe i gniazdowe
RoHS:  
560
E-Seal Waterproof Connectors
Marka: EDAC
Rodzaj produktu: Pin & Socket Connectors
Wielkość opakowania producenta: 96
Podkategoria: Pin & Socket Connectors
Jednostka masy: 60 g
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Wybrane atrybuty: 0

Karta charakterystyki

Images

Models

TARIC:
8536901000
CNHTS:
8538900000
CAHTS:
8536900020
USHTS:
8536904000
JPHTS:
853690000
KRHTS:
8536909010
MXHTS:
8536902800
BRHTS:
85369090
ECCN:
EAR99

E-Seal Waterproof Connectors

EDAC E-Seal Waterproof Connectors use a unique epoxy sealing process that seals the entire back of the connector rather than at the individual pins. This produces a complete seal with a smooth finish and guarantees no water ingress up to IP67 standards. The E-Seal system offers a full range of D-subs from DB 9 to a maximum of 78 positions. Standard and high-density footprints are available in vertical or right angle orientations. EDAC E-Seal Waterproof Connectors plating options vary from gold flash to 30u” of gold and include a wide variety of mounting options.

Agricultural Technology Interconnect Solutions

EDAC Agricultural Technology (Agritech) Interconnect products offer reliable and durable connector solutions that can withstand harsh agricultural environments, including moisture, dust, and UV radiation exposure. These ruggedized solutions, such as IP67-rated connectors like Inline, D-sub, USB, and HDMI, ensure stable connections for sensor modules and heavy machinery. Increased efficiency, productivity, and yield in agricultural operations are achieved due to this reliability and durability. EDAC Agritech Interconnect Solutions support integrating advanced technologies like IoT and machine learning.

Industrial Interconnect Solutions

EDAC Industrial Interconnect Solutions offer various connectors with robust features for demanding industrial automation environments. Many IP67-rated waterproof connectors provide E-Seal technology for comprehensive back-end sealing and guarding against dust, humidity, and water exposure. EDAC Industrial Interconnect Solutions ensure reliable connection and durability amidst mechanical stresses, environmental challenges, and electrical disturbances. The connectors optimize space utilization in densely packed industrial installations and applications, including manufacturing robotics, pharmaceutical manufacturing, food processing, and conveyor systems.

Communication Interconnect Solutions

EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.

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